主要研究領域:
微波量測、轉接特性量測、IC封裝特性量測、低溫共燒陶瓷電路設計、射頻/微波積體電路、毫米波天線陣列封裝
Major Research Areas:
Microwave measurement techniques, transition characterization, IC packaging measurement, LTCC circuit design, mmW/microwave integrated circuit, millimeter wave antenna array packaging