吳宗霖特聘教授的個人資料 - Profile of Tzong-Lin Wu

吳宗霖 Tzong-Lin Wu

國立台灣大學電機工程學系 特聘教授
國立台灣大學電機資訊學院 副院長
國立台灣大學 和碩講座教授
國際電機電子學會 電磁相容期刊 總主編
Distinguished Professor, Department of Electrical Engineering, National Taiwan University
Associate Dean, College of Electrical Engineering and Computer Science, National Taiwan University
Pegatron Chair Professor, National Taiwan University
Editor-in-Chief, IEEE Transactions on Electromagnetic Compatibility

主要研究領域:

電磁相容/干擾，針對信號與電源完整性的晶片-封裝-電路板共設計，微波電路元件設計，三維晶片之電氣分析

Major Research Areas:

Electromagnetic Compatibility (EMC), Chip-Package-PCB Co-Design for Signal/Power Integrity, Microwave Circuit Design, 3-D IC/Interposer Electrical Analysis and Modeling

研究領域摘要:

隨著數位電路的不斷縮小與高速化以及無線通訊的蓬勃發展，各類電子系統之電磁輻射及干擾雜訊所引發的電磁相容問題，為未來系統晶片(SOC)及系統封裝(SIP)設計中，一個相對重要的問題。本電磁相容研究團隊專注於高速、高頻電路晶片，封裝及電路板之電磁相容分析、設計及量測。研究主軸包括：
1.電源完整性及電磁相容研究：針對高速數位電路系統之晶片、封裝及電路板層級之電源網路的地彈雜訊及引發之電磁干擾問題，進行分析與量測，並發展各種創新解決方案。
2.信號完整性研究：針對高速或高頻(10Gbps/GHz以上)之電路封裝互連結構，發展其寬頻等效電路模型，並量測及分析其信號品質特性。
3.電磁遮蔽效應研究：針對複合材料應用於10Gbps/40Gbps之光電收發模組封裝盒之電磁遮蔽效應之設計、理論分析及量測技術之發展。
4.系統級靜電放電模型研究：針對靜電放電(ESD)對電子系統產生之電磁效應及影響，建立理論模型及量測技術，並發展解決方案。

Research Summary:

With the high-speed trend of the electronic circuits and the widely spreading of the wireless communications, the electromagnetic compatibility (EMC) issue resulted from the electromagnetic radiation and interfernce between the digital and/or RF circuits becomes one of the main challenges for the system-on-chip (SOC) and system-on-package (SOP) designs. The EMC Group dedicates on the analysis, design, and measurement for the EMC problems in the high-speed/high-frequency circuits from either chip-level or package-level points of view. Our research includes

1. Power Integrity and their EMC design: This topic focuses on modeling and measurement for the simulatneous switching noise (SSN) or the power/ground bounce noise (P/GBN) in the high-speed digital circuits from chip, package, and PCB level. The electromagnetic interfernce (EMI) issue casued by these noise is also studied. Several novel solutions to eliminate the noises are investigated.

2. Signal Integrity: This topic focuses on the developement of the time-domain algorithm for extracting the SPICE equivalent models of the high-speed/high-frequency interconnects. Analysis and measurement of the signal quality for the interconnects are also studied.

3. Shielding Effectiveness (SE): This topic fosuses on the design, modeling, and measurement of the SE of the composite material applied in the high-speed optical/electronic package housing.

4. System-level Electro-static Discharge (ESD): This topic focuses on the modeling and measurement techniques for the ESD phenomena in the electronic circuits. Solutions for the ESD issues are also studied.

Photo of Tzong-Lin Wu