C. Wang*, P.-C. Chiu*, C.-L. Ko, S.-H. Tseng, and C.-H. Li, “A 340-GHz THz amplifier-frequency-multiplier chain with 360° phase-shifting range and its phase characterization,” IEEE J. Emerg. Sel. Topics Circuits Syst (*Co-first authors), 2024
Y. Wang, T.-Y. Chiu, T.-Y. Chiu, K.-J. Yu, Y.-M. Teng, G.-W. Huang, C.-H. Li, C.-N. Kuo, C.-C. Chiong, and H. Wang, “A Ka- to G-band detector with 5.5-GHz video bandwidth using a modified traveling-wave structure in 65-nm CMOS technology,” IEEE Trans. Circuits Syst. II, Exp. Briefs, vol. 70, no. 4, 1371-1375, Apr. 2023
C.-H. Li and T.-Y. Chiu, “Low-loss Single-Band, Dual-Band, and Broadband mm-Wave and (Sub-)THz Interconnects for THz SoP Heterogeneous System Integration,” IEEE Trans. THz Sci. Technol., vol. 12, no. 2, pp. 130-143, Mar. 2022
T.-Y. Chiu and C.-H. Li, “340-GHz Heterogeneously-Integrated THz Imager with 4°-Beamwidth 16 × 16 IPD Antenna Array for Lensless Terahertz Imaging Applications,” IEEE Access, Vl. 9, pp. 102195-102206, Jul. 2021
T.-Y. Chiu and C.-H. Li, “Low-loss low-cost substrate-integrated waveguide and filter in GaAs IPD technology for terahertz applications,” IEEE Access, vol. 9, pp. 86346-86357, Jun. 2021
C.-H. Li, K.-D. Huang, and T.-Y. Chiu, “A highly-integrated reconfigurable Ka-band receiver supporting active and passive detections in a 90-nm CMOS technology,” IEEE Access, vol. 9, pp. 38342-38351, Mar. 2021
C.-H. Li, W.-T. Hsieh, and T.-Y. Chiu, “A flip-chip-assembled W-band receiver in 90-nm and IPD technologies,” IEEE Trans. Microw. Theory Tech., vol. 67, no. 4, pp. 1628-1639, Apr. 2019
C.-H. Li and T.-Y. Chiu, “Single flip-chip-packaged dielectric resonator antenna for CMOS terahertz antenna array gain enhancement,” IEEE Access, vol. 7, pp. 7737-7746, 2019
C.-H. Li and W.-M. Wu, “A balun-less frequency multiplier with different output by current flow manipulation,” IEEE Trans. Very Large Scale Integr. VLSI Syst., vol. 26, no. 7, pp. 1391-1402, Jul. 2018
C.-H. Li, C.-L. Ko, M.-C. Kuo, and D.-C. Chang, “A 7.1-mW K/Ka-band mixer with configurable bondwire resonators in 65-nm CMOS,” IEEE Trans. Very Large Scale Integr. VLSI Syst., vol. 25, no. 9, pp. 2635-2648, Sept. 2017
C.-H. Li, M.-C. Yu, and H.-J. Lin, “A compact 0.9-/2.6-GHz dual-band RF energy harvester using SiP technique,” IEEE Microw. Wireless Compon. Lett., vol. 27, no. 7, pp. 666-668, Jul. 2017
C.-H. Li and T.-Y. Chiu, “340-GHz low-cost and high-gain on-chip higher order mode dielectric resonator antenna for THz applications,” IEEE Trans. THz Sci. Technol., vol. 7, no. 3, pp. 284-294, May 2017
C.-L. Ko, C.-H. Li, M.-C. Kuo, and D.-C. Chang, “Constant loss contours of matching networks for millimeter-wave LNA design,” IEEE Microw. Wireless Compon. Lett., vol. 26, no. 11, pp. 939-941, Nov. 2016
C.-H. Li, C.-L. Ko, M.-C. Kuo, and D.-C. Chang, “A 340-GHz heterodyne receiver front-end in 40-nm CMOS for THz biomedical imaging applications,” IEEE Trans. THz Sci. Technol., vol. 6, no. 4, pp. 625-636, Jul. 2016
C.-H. Li, T.-Y. Chao, C.-W. Lai, W.-C. Chen, C.-L. Ko, C.-N. Kuo, Y.-T. Cheng, Ming-Ching Kuo, and Da-Chiang Chang, “A 37.5-mW 8-dBm-EIRP 15.5°-HPBW 338-GHz THz transmitter using SoP heterogeneous system integration,” IEEE Trans. Microw. Theory Tech., vol. 63, no. 2, pp. 470-480, Feb. 2015
C.-H. Li, C.-L. Ko, C.-N. Kuo, M.-C. Kuo, and D.-C. Chang, “A 340-GHz triple-push oscillator with differential output in 40-nm CMOS,” IEEE Microw. Compon. Lett., vol. 24, no. 12, pp. 863-865, Dec. 2014
C.-H. Li, C.-L. Ko, C.-N. Kuo, M.-C. Kuo, and D.-C. Chang, “A low-cost DC-to-84-GHz broadband bondwire interconnect for SoP heterogeneous system integration,” IEEE Trans. Microw. Theory Tech., vol. 61, no. 12, pp. 4345-4352, Dec. 2013
C.-L. Ko, C.-H. Li, C.-N. Kuo, M.-C. Kuo, and D.-C. Chang, “A 210 GHz amplifier in 40 nm digital CMOS technology,” IEEE Trans. Microw. Theory Tech., vol. 61, no. 6, pp. 2438-2446, Jun. 2013
C.-H. Li, C.-N. Kuo, and M.-C. Kuo, “A 1.2-V 5.2-mW 20-30-GHz wideband receiver front-end in 0.18-μm CMOS,” IEEE Trans. Microw. Theory Tech., vol. 60, no. 11, pp. 3502-3512, Nov. 2012
C.-H. Li, Y.-L. Liu, and C.-N. Kuo, “The theory of resonator coupling network and its application to receiver front-end design,” International J. Electrical Engineering, vol. 19, no. 2, pp. 45-56, Apr. 2012
C.-H. Li, Y.-L. Liu, and C.-N. Kuo, “A 0.6-V 0.33-mW 5.5-GHz receiver front-end using resonator coupling technique,” IEEE Trans. Microw. Theory Tech., vol. 59, no. 6, pp. 1629-1638, Jun. 2011
T.-Y. Chao, C.-H. Li, Y. C. Chen, H.-Y. Chen, Y.-T. Cheng, and C.-N. Kuo, “An interconnecting technology for RF MEMS heterogeneous chip integration,” IEEE Trans. Electron Devices, vol. 57, no. 4, pp. 928-938, Apr. 2010
Conference & proceeding papers:
C.-H. Li, W.-Z. Su, and Y.-K. Chen, “THz electronics for sensing and communication applications,” SPIE Optics + Photonics, Aug. 2023
C. Wang, P.-C. Chiu, and C.-H. Li, “A W-band phase-shifter-embedded PA in 40-nm CMOS for 6G applications,” IEEE Int. Microwave Symp., Jun. 2023
C.-H. Li and T.-Y. Chiu, “A compact and low-cost THz SoP heterogeneous integration platform,” IEEE Int. Symp. Radio-Frequency Integration Technology, 2022
C. Wang and C.-H. Li, “A G-band frequency doubler in 40-nm digital CMOS for THz applications,” IEEE Int. Symp. Radio-Frequency Integration Technology, 2021
T.-Y. Chiu and C.-H. Li, “A low-power 340-GHz receiver in 40-nm CMOS for THz imaging applications,” IEEE Int. Symp. Radio-Frequency Integration Technology, 2021
T.-Y. Chiu, Y.-L. Lee, C.-L. Ko, S.-H. Tseng, and C.-H. L, “A low-loss balun-embedded interconnect for THz heterogeneous system integration,” IEEE Int. Microwave Symp., pp. 1043-1046, 2020
C. Wang, K.-Y. Chen, Y.-L. Lee, and C.-H. Li, “A X-/Ku-band QFN-packaged GaAs LNA supporting dual-polarization signal reception,” Asia-Pacific Microw. Conf. (APMC), 2019
C.-H. Li and T.-Y. Chiu, “CMOS devices and circuits for THz applications,” Asia-Pacific Microw. Conf. (APMC), 2018
Y.-L. Su, C.-C. Jian, Y.-L. Lee, C.-H. Li, and T. Lohrey, “Dichroic sub-reflector for wide band technique for single offset antenna,” European Microwave Conference, 2018
M.-T. Hsu, T.-Y. Chiu, S.-Y. Wu, Y.-T. Cheng, C.-H. Li, and C.-N. Kuo, “A silicon-based parabolic sub-reflector antenna for gain enhancement and near-field focus applications,” IEEE Int. Conf. Micro Electro Mechanical Syst., 2018
Y.-W. Chang, M.-C. Yu, H.-J. Lin, and C.-H. Li, “Compact low-cost five-band RF energy harvester using system-in-packaging integration,” IEEE Radio Wireless Symposium, 2018
T.-Y. Chiu, C. Wang, W.-T. Hsieh, H.-J. Lin, T.-Y. Lin, R. Liu, D.-C. Chang, and C.-H. Li, “A 340-GHz high-gain flip-chip packaged dielectric resonator antenna for THz imaging applications,” IEEE Int. Symp. Radio-Frequency Integration Technology, 2017
C.-N. Kuo, W.-C. Chen, T.-Y. Chiu, and C.-H. Li, “Enhancement of THz imaging sensing by packaging technology,” IEEE Int. Symp. Radio-Frequency Integration Technology, 2017
Y.-X. Lu, M.-T. Hsu, Y.-T. Cheng, C.-H. Li, and C.-N. Kuo, “Focused source formation using a micro disc-like patch antenna array for THz CMOS transmitter applications,” Transducers, 2017
M.-C. Yu and C.-H. Li, “High-sensitivity and high-efficiency 2.4-GHz RF energy harvester using SiP technique,” URSI Asia-Pacific Radio Science Conference, 2016
C.-H. Li, T.-C. Yan, Y. Chang, C. Chen, and C.-N. Kuo, “Low-cost high-performance CMOS THz imaging system,” 12th Int. SOC Design Conference, 2015
C.-W. Lai, W.-C. Chen, T.-C. Yan, C.-H. Li, and C.-N. Kuo, “The experimental study of THz image sensor in 0.18 μm CMOS technology,” Asia-Pacific Microw. Conf., 2014
C.-W. Lai, W.-C. Chen, T.-C. Yan, C.-H. Li, M.-C. Kuo, and C.-N. Kuo, “The experimental study of THz power detector design in 0.18-μm CMOS technology,” Progress in Electromagnetics Research Symposium, 2014
C.-H. Li, J.-J. Wu, C.-N. Kuo, Y.-T. Cheng, and M.-C. Kuo, “A broadband interconnect for THz heterogeneous system integration,” IEEE Int. Microwave Symp., 2013
C.-H. Li, C.-L. Ko, C.-N. Kuo, M.-C. Kuo, and D.-C. Chang, “ low-cost broadband bondwire interconnect for heterogeneous system integration,” IEEE Int. Microwave Symp., 2013
C.-H. Li, C.-N. Kuo, and M.-C. Kuo, “A high Q on-chip bondwire transformer and its application to low power receiver front-end design,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2013
C.-H. Li and C.-N. Kuo, “16.9-mW 33.7-dB gain mmWave receiver front-end in 65 nm CMOS,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2012
C.-H. Li, C.-Y. Hsu, and C.-N. Kuo, “Low power 2.4 GHz receiver front-end using resonator coupling technique,” 54 th IEEE Int. Midwest Symp. Circuits Syst., 2011
C.-H. Li and C.-N. Kuo, “Design optimization of a 1.4 GHz low power bulk-driven mixer,” Asia-Pacific Microw. Conf., 2010
Y.-L. Liu, C.-H. Li, and C.-N. Kuo, “Low voltage low power 5-GHz doubled balanced mixer with active phase shifter,” Asia-Pacific Microw. Conf., 2010
C.-H. Li, C. T. Fu, T.-Y. Chao, C.-N. Kuo, Y.-T. Cheng, and D.-C. Chang, “Broadband flip-chip interconnects for millimeter-wave Si-carrier system-on-package,” IEEE Int. Microwave Symp., 2007
Y. C. Chen, C.-H. Li, J. K. Huang, C.-N. Kuo, and Y.-T. Cheng, “Low power 3~8 GHz UWB tunable LNA design using SiP technology,” IEEE Int. Conf. Electronics Circuits Syst., 2006
C.-H. Li, C.-N. Kuo, and C.-L. Ko, “Interconnecting structure for electrically connecting a first electronic device and a second electronic device,” US9577308B2, Feb. 2017
C.-H. Li and C.-N. Kuo, “Broadband connection structure and method,” US9450650B2, Sept. 2016
李俊興、郭建男, “寬頻連接結構及其連接方法、傳輸裝置及傳輸寬頻訊號的方法,” 中華民國專利，I532351, May 2016