Y.-H. Chang, C.-H. Hsieh, S.-P. Cheng, Y. Li, S.S., T. -L. Wu and Z.-M. Tsai, “A 0.6-dB Low Loss and 3-165 GHz Wideband Phase Difference Sub-THz Coupler in 0.18-μm CMOS,” IEEE Microw. Wirel. Compon. Lett., 32(6), 531-534, Jun. 2022
L. -C. Huang, C.-H. Cheng, S. Chen and T. -L. Wu, “A Novel Absorptive Power Delivery Network for Power Noise Mitigation,” IEEE Trans. Electromagn. Compat., 64(2), 536-542, Apr. 2022
Y. -T. Chang, K.-Y. Ling and T. -L. Wu, “Wideband Reconfigurable Power Divider/Combiner in 40-nm CMOS for 5G mmW Beamforming System,” IEEE Trans. Microw. Theory Techn., 70(2), 1410-1422, Feb. 2022
H. -W. Liu, C.-H. Cheng, P. -J. Li and T. -L. Wu, “A Novel Compact Single-Stage Absorption Common-Mode Filter,” IEEE Trans. Electromagn. Compat., 64(1), 111-118, Feb. 2022
C. -Y. Liu, H. -E. Ding, S. -H. Wu and T. -L. Wu, “Extremely Low-Loss Planar Transition From Hollow Dielectric Waveguide to Printed Circuit Board for Millimeter-Wave Interconnect,” IEEE Trans. Microw. Theory Techn., 69, 4010-4020, Sept. 2021
S. Chen and T. -L. Wu, “A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network,” IEEE Trans. Compon. Packag. Manuf. Technol., 11(9), 1514-1514, Sept. 2021
C.-Y. Liu, H.-E. Ding, S.-H. Wu and T.-L. Wu, “Significant Crosstalk Reduction in High-Density Hollow Dielectric Waveguides by Photonic Crystal Fence,” IEEE Trans. Microw. Theory Techn., vol. 69, no. 2, 1316-1326, Feb. 2021
C.-C. Chou and T.-L. Wu, “Poles and Stability of Full-Wave PEEC,” IEEE Trans. Antennas Propag., vol. 69, no. 2, 950-961, Feb. 2021
S. Chen and T.-L. Wu, “A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 10, no. 11, 1889-1901, Nov. 2020
T.-Y. Lin and T.-L. Wu, “Balanced Bandpass Filter With Common-Mode Reflectionless Feature by Terminated Coupled Lines,” IEEE Trans. Electromagn. Compat., vol. 62, no. 4, 1090-1097, Aug. 2020
P.-J. Li and T.-L. Wu, “A Novel Circuit Architecture of Bidirectional Common-Mode Noise Absorption Circuit,” IEEE Trans. Microw. Theory Techn., vol. 68, no. 4, 1476-1486, Apr. 2020
C.-K. Chan and T.-L. Wu, “A High-Performance Common-Mode Noise Absorption Circuit Based on Phase Modification Technique,” IEEE Trans. Microw. Theory Techn., vol. 67, no. 11, 4394-4403, Nov. 2019
P.-S. Wei, C.-N. Chiu, and T.-L. Wu, “Design and Analysis of an Ultraminiaturized Frequency Selective Surface With Two Arbitrary Stopbands,” IEEE Trans. Electromagn. Compat., vol. 61, no. 5, 1447-1456, Oct. 2019
S. Chen, W.-C. Lee, and T.-L. Wu, “A Resistor-Free $N$ -Way Power Divider With Simultaneous Output Matching and Isolation,” IEEE Microw. Wireless Compon. Lett., vol. 29, no. 8, 523-525, Aug. 2019
C.-C. Chou, S.-S. Weng, Y.-C. Lu, and T.-L. Wu, “EMI-Reduction Coding Based on 8b/10b,” IEEE Trans. Electromagn. Compat., vol. 61, no. 4, 1007-1014, Aug. 2019
C.-K. Chan, C.-H. Cheng, and T.-L. Wu, “Design of a Broadband Common-Mode Filter With Four Transmission Zeros,” IEEE Trans. Electromagn. Compat., vol. 61, no. 4, 1052-1060, Aug. 2019
C.-C. Chou and T.-L. Wu, “Direct Simulation of the Full-Wave Partial Element Equivalent Circuit Using Standard SPICE [Application Notes],” IEEE Microw. Mag., vol. 20, no. 6, 22-34, Jun. 2019
Y.-C. Huang, C.-H. Cheng, and T.-L. Wu, “A Synthesized Method for Common-Mode Noise Suppression Filters With Specified Common-Mode and Differential Mode Response,” IEEE Trans. Electromagn. Compat., vol. 61, no. 3, 893-902, Jun. 2019
C.-H. Cheng and T.-L. Wu, “Analysis and Design Method of a Novel Absorptive Common-Mode Filter,” IEEE Trans. Microw. Theory Techn., vol. 67, no. 5, 1826-1835, May 2019
P.-J. Li and T.-L. Wu, “Synthesized Method of Dual-Band Common-Mode Noise Absorption Circuits,” IEEE Trans. Microw. Theory Techn., vol. 67, no. 4, 1392-1401, Apr. 2019
C.-W. Lin, C.-K. Shen, C.-N. Chiu and T.-L. Wu, “Design and Modeling of a Compact Partially Transmissible Resistor-Free Absorptive Frequency Selective Surface for Wi-Fi Applications,” IEEE Trans. Antennas Propag., vol. 67, no. 2, 1306-1311, Feb. 2019
S. Chen, W.-C. Lee and T.-L. Wu, “Balanced-to-Balanced and Balanced-to-Unbalanced Power Dividers With Ultra-Wideband Common-Mode Rejection and Absorption Based on Mode-Conversion Approach,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 9, no. 2, 306-316, Feb. 2019
P.-S. Wei, M.-H. Tsai, S.-K. Hsu, C.-K. Shen and T.-L. Wu, “An Electromagnetic Bandgap Structure Integrated With RF LNA Using Integrated Fan-Out Wafer-Level Package for Gigahertz Noise Suppression,” IEEE Trans. Microw. Theory Techn., vol. 66, no. 12, 5484-5490, Dec. 2018
P.-J. Li, C.-H. Cheng, and T.-L. Wu, “A Resistor-Free Absorptive Common-Mode Filter Using Gap-Coupled Resonator,” IEEE Microw. Wirel. Compon. Lett., vol. 28, no. 10, pp. 885-887, Oct. 2018
C. Y. Lin, Y. C. Huang, and T. L. Wu, “Codesign of Electrostatic Discharge Protection Device and Common Mode Suppression Circuit on Printed Circuit Board,” IEEE Trans. Electromagn. Compat., vol. 60, no. 4, pp. 1095-1101, Aug. 2018
H. L. Ting, S. K. Hsu and T. L. Wu, “Broadband Eight-Port Forward-Wave Directional Couplers and Four-Way Differential Phase Shifter,” IEEE Trans. Microw. Theory Techn., vol. 66, no. 5, pp. 2161-2169, May 2018
C. W. Lin, C. K. Shen and T. L. Wu, “Ultracompact Via-Based Absorptive Frequency-Selective Surface for 5-GHz Wi-Fi With Passbands and High-Performance Stability,” IEEE Trans. Compon. Packag. Manuf. Techn., vol. 8, no. 1, pp. 41-49, Jan. 2018
C.-C. Chou and T.-L. Wu, “Analysis of peak and statistical spectrum of random nonreturn-to-zero digital signals,” IEEE Trans. Electromag. Compat., vol. 59, no. 6, pp. 2002-2013, Dec. 2017
C. K. Shen, Y. C. Lu, Y. P. Chiou, H. H. Hsieh, M. H. Tsai, S. Liu, and T. L. Wu, “EBG-Based Grid-Type PDN on Interposer for SSN Mitigation in Mixed-Signal System-in-Package,” IEEE Microw. Wirel. Compon. Lett., vol. 27, no. 12, pp. 1053-1055, Dec. 2017
Y.-A. Hsu, C.-H. Cheng, Y.-C. Lu, and T.-L. Wu, “An accurate and fast substrate noise prediction method with octagonal TSV model for 3-D ICs,” IEEE Trans. Electromag. Compat., vol. 59, no. 5, pp. 1549-1557, Oct. 2017
H.-L. Ting, S.-K. Hsu and T.-L. Wu, “A Novel and Compact Eight-Port Forward-Wave Directional Coupler With Arbitrary Coupling Level Design Using Four-Mode Control Technology,” IEEE Trans. Microw. Theory Techn, vol. 65, no. 2, pp. 467-475, Feb. 2017
C. C. Chou, W. C. Lee and T. L. Wu, “A Rigorous Proof on the Radiation Resistance in Generalized PEEC Model,” IEEE Trans. Microw. Theory Techn., vol. 64, no. 12, pp. 4091-4097, Dec. 2016
Y. J. Lin, Y. C. Tseng and T. L. Wu, “A Resonator-Based Suppressor for Mitigating the Noise Transfer on Metal Plates for Control of Electromagnetic Interference,” IEEE Trans. Microw. Compon. Lett., vol. 26, no. 11, pp. 906-908, Nov. 2016
C.-K. Shen, S. Chen, and T.-L. Wu, “Compact Cascaded-Spiral-Patch EBG Structure for Broadband SSN Mitigation in WLAN Applications,” IEEE Trans. Microw. Theory Techn., vol. 64, no. 9, pp. 2740-2748, Sept. 2016
C.-H. Cheng, and T.-L. Wu, “An Ultracompact TSV-Based Common-Mode Filter (TSV-CMF) in Three-Dimensional Integrated Circuits (3-D ICs),” IEEE Trans. Electromag. Compat., vol. 58, no. 4, pp. 1128-1135, Aug. 2016
W.-J. Liao, R.-B. Wu, T.-L. Wu, T.-G. Ma, Y.-H. Pang, Z.-M. Tsai, H.-H. Yu, K.-M. Tu, H.-C. Lin, and S.-T. Peng, “Promoting Effective Education in Electromagnetics - Taiwan’s School of Accessible and Visualized Electromagnetics Formed,” IEEE Antennas Propag. Mag., pp. 99-129, Feb. 2016
H.-C. Chen, S. Connor, M. S. Halligan, X. Tian, X. Li, B. Archambeault, J. L. Drewniak, and T.-L. Wu, “Investigation of the Radiated Emissions From High-Speed/High-Density Connectors,” IEEE Trans. Electromag. Compat., vol. 58, no. 1, pp. 220-230, Feb. 2016
Y.-C. Tseng, H.-L. Ting, and T.-L. Wu, “A quadruplet-resonator based ferrite-free choke for suppressing noise currents on cable shielding,” IEEE Trans. Microw. Theory Techn., vol. 64, no. 1, pp. 86-95, Jan. 2016
C.-C. Chou, S.-Y. Hsu, and T.-L. Wu,, “Estimation Method for Statistical Eye Diagram in a Nonlinear Digital Channel,” IEEE Trans. Electromag. Compat., vol. 57, no. 6, pp. 1655-1664, Dec. 2015
C.-Y. Hsiao, Y.-C. Huang, and T.-L. Wu, “An Ultra-Compact Common-Mode Bandstop Filter With Modified-T Circuits in Integrated Passive Device (IPD Process,” IEEE Trans. Microw. Theory Techn., vol. 63, no. 11, pp. 3624-3631, Nov. 2015
F.-C. Huang, C.-N. Chiu, T.-L. Wu, and Y.-P. Chiou, “A Circular-Ring Miniaturized-Element Metasurface with Many Good Features for Frequency Selective Shielding Applications,” IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 3, pp. 365-374, Jun. 2015
C.-Y. Hsiao, C.-H. Cheng, and T.-L. Wu, “A New Broadband Common-Mode Noise Absorption Circuit for High-Speed Differential Digital Systems,” IEEE Trans. Microw. Theory Tech., vol.63, no.6, pp. 1894-1901, Jun. 2015
C.-K. Shen, C.-H. Chen, D.-H. Han, and T.-L. Wu, “Modeling and Analysis of Bandwidth-Enhanced Multilayer 1-D EBG With Bandgap Aggregation for Power Noise Suppression,” IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 4, pp. 858-867, May 2015
Y.-M. Yu, C.-N. Chiu, Y.-P. Chiou, T.-L. Wu, “An Effective Via-Based Frequency Adjustment and Minimization Methodology for Single-Layered Frequency Selective Surfaces,” IEEE Trans. Antennas Propag., vol.63, no.4, pp. 1641-1649, Jan. 2015
F.-C. Huang, C.-N. Chiu, T.-L. Wu, and Y.-P. Chiou, “Very Closely Located Dual-band Frequency Selective Surfaces via Identical Resonant Elements,” IEEE Antennas and Wireless Propagation Letters, vol.14, pp. 414-417, Oct. 2014
C.-Y. Hsiao and T.- L. Wu, “A novel dual-function circuit combining high-speed differential equalizer and common-mode filter with an additional zero,” IEEE Microw. Wireless Compon. Lett., vol. 24, no. 9, pp. 617-619, Sept. 2014
T.-W. Weng, C.-H. Tsai, C.-H. Chen, D.-H. Han, and T.-L. Wu, “Synthesis Model and Design of a Common-Mode Bandstop Filter (CM-BSF) With an All-Pass Characteristic for High-Speed Differential Signals,” IEEE Trans. Microw. Theory Tech., vol.62, no.8, pp. 1647-1656, Aug. 2014
C.-H. Cheng, T.-Y. Cheng, C.-H. Du, Y.-C. Lu, Y.-P. Chiou, Sally Liu, T.-L. Wu, “An Equation-Based Circuit Model and its Generation Tool for 3-D IC Power Delivery Networks with an Emphasis on Coupling Effect,” IEEE Trans. Compon. Packag. Manuf. Technol., vol.4, no.6, pp. 1062-1070, Jun. 2014
H.-H. Chuang, G.-H. Li, E. Song, H.-H. Park, H.-T. Jang, H.-B. Park, Y.-J. Zhang, D. Pommerenke, T.-L. Wu, and J. Fan, “A magnetic-field resonant probe with enhanced sensitivity for RF interference applications,” IEEE Trans. Electromag. Compat., vol. 55, no. 6, pp. 991-998, Dec. 2013
T.-H. Lin, S.-K. Hsu, and T.-L. Wu, “Bandwidth enhancement of 4 x 4 butler matrix using broadband forward-wave directional coupler and phase difference compensation,” IEEE Trans. Microw. Theory Tech., vol. 61, no. 12, pp. 4099-4109, Dec. 2013
C.-D. Wang, Y.-J. Chang, Y.-C. Lu, P.-S. Chen, W.-C. Lo, Y.-P. Chiou, and T.-L. Wu, “ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 10, pp. 1744-1753, Oct. 2013
Y.-J. Cheng, H.-H. Chuang, C.-K. Cheng, and T.-L. Wu, “Novel differential-mode equalizer with broadband common-mode filtering for Gb/s differential-signal transmission,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 9, pp. 1578-1587, Sept. 2013
T.-L. Wu, F. Buesink, and F. Canavero, “Overview of signal integrity and EMC design technologies on PCB:fundamentals and latest progress,” IEEE Trans. Electromag. Compat., vol. 55, no. 4, pp. 624-638, Aug. 2013
C.-D. Wang and T.-L. Wu, “Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression,” IEEE Trans. Electromag. Compat., vol. 55, no. 1, pp. 159-167, Feb. 2013
C.-H. Huang and T.-L. Wu, “Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 1, pp. 21-30, Jan. 2013
J.-C. Yen, S.-K. Hsu, T.-H. Lin, and T.-L. Wu, “A Broadband Forward-Wave Directional Coupler Using Periodic Y-Shaped Ground Via Structures With Arbitrary Coupling Levels,” IEEE Trans. Microw. Theory Tech., vol.61, no.1, pp. 38-47, Jan. 2013
H.-H. Chuang, C.-C. Chou, Y.-J. Chang, and T.-Z. Wu, “A branched reflector technique to reduce crosstalk between slot-crossing differential line,” IEEE Microw. Wireless Compon. Lett., vol. 22, no. 7, pp. 342-344, Jul. 2012
T.-Y. Cheng, C.-D. Wang, Y.-P. Chiou, and T.-L. Wu, “A new macro-π model for through-silicon vias on 3-D IC using conformal mapping method,” IEEE Microw. Wireless Compon. Lett., vol. 22, no. 6, pp. 303 - 305, Jun. 2012
H.-C. Chen, C.-H. Tsai, and T.-L. Wu, “A compact and embedded balanced bandpass filter with wideband common-mode suppression on wireless SiP,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 2, no. 6, pp. 1030-1038, Jun. 2012
C.-D. Wang, Y.-M. Yu, F. d. Paulis, A. C. Scogna, A. Orlandi, Y.-P. Chiou, and T.-L. Wu, “Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 2, no. 2, pp. 332-341, Feb. 2012
C.-H. Tsai, I.-I. A. Ieong, H.-C. Chen, and T.-L. Wu, “A miniaturized and broadband balun using artificial couopled line with imaginary even-mode impedance,” IEEE Trans. Microw. Theory Tech., vol. 59, no. 9, pp. 2233-2240, Sept. 2011
H.-H. Chuang and T.-L. Wu, “Suppression of common-mode radiation and mode-conversion for slot-crossing GHz differential signals using novel grounded resonators,” IEEE Trans. Electromagn. Compat., vol. 53, no. 2, pp. 429-436, May 2011
S.-K. Hsu, J.-C. Yen, and T.-L. Wu, “A novel compact forward-wave directional coupler design using periodical patterned ground structure,” IEEE Trans. Microw. Theory Tech., vol. 59, no 5, pp. 1249-1257, May 2011
H. H. Chuang and T. L. Wu, “A novel ground resonator technique to reduce common-mode radiation on slot-crossing differential signals,” IEEE Microw. Wireless Compon. Lett., vol. 20, no. 12, pp. 660 - 662, Dec. 2010
C.-H. Cheng, C.-H. Tsai, and T.-L. Wu, “A novel time domain method to extract equivalent circuit model of patterned ground structures,” IEEE Microw. Wireless Compon. Lett., vol. 20, no. 9, pp. 486-488, Oct. 2010
C.-Y. Hsieh, C.-D. Wang, K.-Y. Lin, and T.-L. Wu, “A power bus with multiple via ground surface perturbation lattices for broadband noise isolation: modeling and application in RF-SiP,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 582-591, Aug. 2010
S.-K. Hsu, C.-H. Tsai, and T.-L. Wu, “A novel miniaturized forward-wave directional coupler with periodical mushroom-shaped ground plane,” IEEE Trans. Microw. Theory Tech., vol. 58, no. 8, pp. 2277-2283, Aug. 2010
T.-L. Wu, J. Fan, F. d. Paulis, C.-D. Wang, A. C. Scogna, and A. Orlandi, “Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology,” IEICE Trans. Commun. (Invited paper), vol .E93-B, no. 07, Jul. 2010
A. Ciccomancini, T. L. Wu, and A. Orlandi, “Noise coupling mitigation in PWR/GND plane pair by means of photonic crystal fence: sensitivity analysis and design parameters extraction,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 574-581, May 2010
W.-Y. Huang, T.-K. Wang, and T.-L. Wu, “Design and modelling of miniaturized bandgap structure for wideband GHz-noise suppression based on LTCC technology,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 630-638, May 2010
T.-L. Wu, H.-H. Chuang, and T.-K. Wang, “Overview of power integrity solutions on package and PCB: decoupling and EBG isolation,” IEEE Trans. Electromagn. Compat. (Invited paper), vol. 52, no. 2, pp. 346-356, May 2010
H.-H. Chuang, W.-D. Guo, Y.-H. Lin, H.-S. Chen, Y-C Lu, J. Hong, C.-H. Yu, A. Cheng, J. Chou, C.-J. Chang, J. Ku, T.-L. Wu, and R.-B. Wu, “Signal/Power integrity modeling of high-speed memory modules using chip-package-board co-analysis,” IEEE Trans. Electronmagn. Compat., vol. 52, no. 2, pp. 381-391, May 2010
H.-H. Chuang, C.-J. Hsu, J. Hong, C.-H. Yu, A. Cheng, J. Ku, and T.-L. Wu, “A broadband chip-level power-bus model feasible for power integrity chip-package co-design in high-speed memory circuits,” IEEE Trans. Electromagn. Compat., vol. 52, no. 1, pp. 235-239, Feb. 2010
G.-Z. Wu, Y.-C. Chen, and T.-L. Wu, “Design and implementation of a novel hybrid photonic crystal power/ground layer for broadband power noise suppression,” IEEE Trans. Adv. Packag., vol. 33, no. 1, pp. 206-211, Feb. 2010
C.-H. Tsai and T.-L. Wu, “A broadband and miniaturized common-mode filter for gigahertz differential signals based on negative permittivity metamaterials,” IEEE Trans. Microw. Theory Tech., vol. 58, no. 1, pp. 195-202, Jan. 2010
T.-K. Wang, C.-Y. Hsieh, H.-H. Chuang, and T. L. Wu, “Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression,” IEEE Trans. Microw. Theory Tech., vol. 57, no. 8, pp. 2047-2054, Aug. 2009
S.-J. Wu, C.-H, Tsai, T.-L. Wu, and T.-Itoh, “A novel wideband common-mode suppression filter for GHz differential signals using coupled patterned ground structure,” IEEE Trans. Microw. Theory Tech., vol. 57, no.4, pp. 848-855, Apr. 2009
T.-K. Wang, T.-W. Han, and T.-L. Wu, “A novel power/ground layer using artificial substrate EBG for simultaneously switching noise suppression,” IEEE Trans. Microw. Theory Tech., vol. 56, no. 5, pp. 1164-1171, May 2008
W.-T. Liu, C.-H. Tsai, T.-W. Han, and T.-L. Wu, “An embedded common-mode suppression filter for GHz differential signals using periodic defected ground plane,” IEEE Microw. Wireless Compon. Lett., vol. 18, no. 4, pp. 248-250, Apr. 2008
P.-J. Cheng, T.-L. Wu, S.-W. Shaw, H.-Y. Chueh, C.-T. Lin, J.-J. Hsu, T.-T. Hsieh, and Y.-K. Soong, “Anxiety levels in women undergoing prenatal maternal serum screening for down syndrome: the effect of a fast reporting system by mobile phone short-message service,” Prenat. Diagn., vol. 28, pp. 417-421, Apr. 2008
T.-K. Wang, S.-T. Chen, C.-W. Tsai, S.-M. Wu, J. J. Drewniak, and T.-L. Wu, “Modeling noise coupling between package and PCB power/ground planes with an efficient 2D-FDTD/lumped element method,” IEEE Trans. Adv. Packag., vol. 30, no. 4, pp. 864-871, Nov. 2007
C.-H. Chao, S. L. Chuang, and T.-L. Wu, “Theoretical demonstration of enhancement of light extraction of flip-chip GaN light-emitting diodes with photonic crystals,” Appl. Phy. Lett., vol. 89, pp. 091116, Dec. 2006
C.-C. Wang, C.-W. Ku, C.-C. Kuo, and T.-L. Wu, “A time-domain approach for extracting broadband macro-π models of differential via holes,” IEEE Trans. Adv. Packag., vol. 29, no. 4, pp. 789-797, Nov. 2006
C.-M. Chang, J.-C. Chiu, W.-S. Jou, T.-L. Wu, W.-H. Cheng, “New package scheme of a 2.5Gb/s plastic tranceiver module employing mutiwall nanotubes for low electromagnetic interference,” IEEE J. Select. Top. Quantum Electron., vol. 12, no. 5, pp. 1025-1031, Oct. 2006
T.-L. Wu and S.-T. Chen, “A photonic crystal power/ground layer for eliminating simultaneously switching noise in high-speed circuit,” IEEE Trans. Microw. Theory Tech., vol. 54, no. 8, pp. 3398-3406, Sept. 2006
T.-L. Wu, M.-C. Lin, C.-W. Lin, W.-S. Jou, T.-T. Shih, and W.-H. Cheng, “A high electromagnetic immunity plastic composite package for a 10-gb/s optical transceiver module,” IEEE/OSA J. Lightw. Technol., vol. 24, no. 8, pp. 3195-3201, Aug. 2006
T.-L. Wu and S.-T. Chen, “An electromagnetic crystal power substrate with efficient suppression of power/ground plane noise on high-speed circuits,” IEEE Microw. Wireless Compon. Lett., vol. 16, no. 7, pp. 413-415, Jun. 2006
J.-S. Chiang and T.-L. Wu, “Analysis of propagation characteristics for an octagonal photonic crystal fiber (O-PCF),” Opt. Commun. (SCI), vol. 258, pp. 170-176, Feb. 2006
T. L. Wu and T. K. Wang, “Embedded power plane with ultra-wide stop-band for simultaneously switching noise on high-speed circuits,” Electron. Lett., vol. 42, no. 4, pp. 213-214, Feb. 2006
T.-L. Wu, Y.-H. Lin, T.-K. Wang, C.-C. Wang, and S.-T. Chen, “Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits,” IEEE Trans. Microw. Theory Tech. (SCI, NSC 93-2213-E-110-010), vol. 53, no. 9, pp. 2935-2942, Sept. 2005
T.-L. Wu and C.-H. Chao, “An efficient approach for calculating the dispersions of photonic crystal fibers: design of the nearly zero ultra-flattened dispersion,” IEEE/OSA J. Lightw. Technol. (SCI), vol. 23, no. 6, pp. 2055-2061, Jun. 2005
T.-L. Wu , C.-C. Wang, C.-C. Kuo, and J.-S. Hsieh, “A novel time-domain method for synthesizing broadband macro-PI models of differential via,” IEEE Microw. Wireless Compon. Lett. (SCI), vol. 15, no. 5, pp. 378-380, May 2005
T.-L. Wu, M.-C. Lin, C.-H. Lee, T.-T. Shih, and W.-H. Cheng, “High electromagnetic susceptibility (EMS) plastic package for 10Gbps optical transceiver module,” Electron. Lett. (SCI), vol. 41, no. 8, pp. 494-495, Apr. 2005
T.-L. Wu, Y.-H. Lin and T.-K. Wang, “A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits,” IEEE Microw. Wireless Compon. Lett. (SCI), vol. 15, no. 3, pp. 174-176, Mar. 2005
T.-L. Wu, C.-W. Lin, W.-C. Hung, C.-H. Lee, W.-S. Jou, and W.-H. Cheng, “High electromagnetic shielding of plastic package for 2.5Gbps optical transceiver modules,” IEEE Trans. Adv. Packag., vol. 28, no. 1, pp. 89-95, Feb. 2005
T.-L. Wu and C.-H. Chao, “A novel ultra-flattened dispersion photonic crystal fiber,” IEEE Photon. Technol. Lett. (SCI), vol. 17, no. 1, pp. 67-69, Jan. 2005
W.-H. Cheng, W.-C.Hung, C.-H. Lee, G.-L. Hwang, W.-S. Jou, and T.-L. Wu, “Low cost and low electromagnetic interference packaging of optical transceiver modules,” IEEE/OSA J. Lightw. Technol. (SCI), vol. 22, no. 9, pp. 2177-2183, Sept. 2004
T.-L. Wu, Y.-H. Lin, and S.-T. Chen, “A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures,” IEEE Microw. Wireless Compon. Lett. (SCI), vol. 14, no. 7, pp. 337-339, Jul. 2004
T.-L. Wu, J.-S. Chiang, and C.-H. Chao, “A novel approach for calculating the dispersions of photonic crystal fibers,” IEEE Photon. Technol. Lett. (SCI), vol. 16, no. 6, pp. 1492-1494, Jun. 2004
T.-L. Wu, W.-S. Jou, W.-C. Hung, C.-H. Lee, C.-W. Lin, and W.-H. Cheng, “A high shielding effectiveness plastic package for 2.5Gbps optical transceiver module,” Electron. Lett. (SCI), vol. 4, no. 4, pp. 260- 262, Feb. 2004
T.-L. Wu, Y.-S. Huang, and S.-T. Chen, “A novel approach for the incorporation of arbitrary linear lumped network into FDTD method,” IEEE Microw. Wireless Compon. Lett. (SCI, NSC91-2213-E-110-034), vol. 14, no. 2, pp. 74-76, Feb. 2004
T.-L. Wu, C.-C. Kuo, C.-C. Wang, S.-M. Wu, and C.-P. Hung, “A novel time-domain algorithm for synthesizing broadband macromodels of coupled interconnects,” IEEE Trans. on Adv. Packag. (SCI), vol. 27, no. 1, pp. 224-232, Feb. 2004
T.-L. Wu, S.-T. Chen, J.-N. Huang, and Y.-H. Lin, “Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB,” IEEE Trans. Electromagn. Compat. (SCI, NSC91-2213-E-110-034), vol. 46, no. 1, pp. 33-45, Feb. 2004
T.-L. Wu and H.-J. Ou, “Rigorous analysis of polarization dependence loss (PDL) for equilateral 3x3 fused fiber couplers,” IEEE Photon. Technol. Lett. (SCI, NSC92-2215-E-110-005), vol. 16, no. 1, pp. 165-167, Jan. 2004
T.-L. Wu and C.-H. Chao, “Photonic crystal fiber analysis through the vector boundary-element method: effect of elliptical air hole,” IEEE Photon. Technol. Lett. (SCI, NSC91-2215-E-110-018), vol. 16, no. 1, pp. 126-128, Jan. 2004
T.-L. Wu and C.-H. Chao, “3D electromagnetic modeling of polarization-dependent coupling characteristics of 1x3 linear array weakly fused fiber couplers,” Fiber Integr. Opt. (SCI, NSC91-2215-E-110-018), vol. 22, no. 6, pp. 415-432, Nov. 2003
T.-L. Wu and H.-J. Ou, “A vector power coupling model for analyzing polarization dependent loss (PDL) of equilateral triangular 3x3 weakly fused fiber couplers,” Opt. Commun. (SCI, NSC 91-2215-E-110-018), vol. 224, pp. 81-88, Aug. 2003
T.-L. Wu, C.-C. Kuo , H.-C. Chang, and J.-S. Shie, “A novel systematic approach for equivalent model extraction of embedded high-speed interconnects in time domain,” IEEE Trans. Electromagn. Comapt. (SCI, NSC91-2213-E-110-034), vol. 45, no. 3, pp. 493-501, Aug. 2003
T.-L. Wu, W.-S. Jou, S.-G. Dai, and W.-H. Cheng, “Effective electromagnetic shielding of plastic packaging in low-cost optical transceiver modules,” IEEE/OSA J. Lightw. Technol. (SCI, NSC90-2215-E-110-029), vol. 21, no. 6, pp. 1536-1543, Jun. 2003
W.-S. Jou, T.-L. Wu, S.-K. Chiu, and W.-H. Cheng, “The influence of fiber orientation on electromagnetic shielding in liquid crystal polymers,” IEEE/TMS J. Electron. Mater. (SCI), vol. 31, no. 3, pp. 178-184, Mar. 2002
T.-L. Wu, Y.-H. Lin, J.-N. Huang, and J.-J. Lin, “The effect of test system impedance on measurements of ground bounce in printed circuit boards,” IEEE Trans. Electromagn. Compat. (SCI, NSC89-2215-E-110-004), vol. 43, no. 4, pp. 600-607, Nov. 2001
W.-S. Jou, T.-L. Wu, S.-K. Chiu, and W.-H. Cheng, “Electromagnetic shielding of nylon-66 composites applied to laser modules,” IEEE/TMS J. Electron. Mater. (SCI), vol. 30, no. 10, pp. 1287-1293, 2001
T.-L. Wu, “Three dimensional dlectromagnetic modeling of fiber-core effect on the coupling characteristics of weakly fused couplers,” IEEE/OSA J. Lightw. Technol. (SCI, NSC88-2218-E-110-009), vol. 18, no. 7, pp. 1024-1030, Jul. 2000
W.-H. Cheng, J.-Y. Cheng, T.-L. Wu, C.-M. Wang, S.-C. Wang, and W.-S. Jou, “Electromagnetic shielding of plastic packaging in low-cost laser modules,” Electron. Lett. (SCI, NSC88-2215-E-110-007), vol. 36, no. 2, pp. 118-119, Jan. 2000
C.-S. Hsieh, T.-L. Wu, and W.-H. Cheng, “An optimum approach for fabrication of low loss fused fiber couplers,” Mater. Chemistry Phy. (SCI), pp. 846-851, Jan. 2000
T.-L. Wu, “Vectorial analysis for polarization effect of wavelength-flattened fiber-optic couplers,” Microw. Opt. Technol. Lett. (SCI), vol. 23, no. 1, Oct. 1999
S.-W. Yang, T.-L. Wu, C.-W. Wu, and H.-C. Chang, “Numerical modeling of weakly fused fiber-optic polarization beamsplitter - part II: the three-dimensional electromagnetic model,” IEEE/OSA J. Lightw. Technol. (SCI), vol. 16, no. 4, pp. 691-697, Apr. 1998
T.-L. Wu, “Vectorial analysis of fiber-core effects in weakly fused couplers,” IEEE Photon. Technol. Lett. (SCI), vol. 9, no. 2, pp. 218-219, Feb. 1997
C.-W. Wu, S.-T. Lu, T.-L. Wu, and H.-C. Chang, “All-fiber brewster windows made with extremely weakly fused asymmetrical coupler,” IEEE Photon. Technol. Lett. (SCI), vol. 7, no. 9, pp. 1054-1056, Sept. 1995
T.-L. Wu and H.-C. Chang, “An efficient numerical approach for determining the dispersion characteristics of dual-mode elliptical-core optical fibers,” IEEE/OSA J. Lightw. Technol. (SCI), vol. 13, no. 9, pp. 1926-1934, Sept. 1995
H.-C. Chang, T.-H. Lin, and T.-L. Wu,, “Accurate coupling coefficients for fiber couplers with weakly-fused cross sections,” Appl. Opt. (SCI), vol. 34, no. 27, pp. 6168-6171, Sept. 1995
C.-W. Wu, T.-L. Wu, and H.-C. Chang, “A novel fabrication method for all-fiber weakly fused polarization beamsplitters,” IEEE Photon. Technol. Lett. (SCI), vol. 7, no. 7, pp. 786-788, Jun. 1995
T.-L. Wu and H.-C. Chang, “Rigorous analysis of form birefringence of weakly fused fiber-optic couplers,” IEEE/OSA J. Lightw. Technol. (SCI), vol. 13, no. 4, pp. 687-691, Apr. 1995
T.-L. Wu and H.-C. Chang, “Rigorous analysis of form birefrigence of fused fiber couplers,” Electron. Lett. (SCI), vol. 30, no. 12, pp. 998-999, Jul. 1994
Conference & proceeding papers:
P.-Y. Weng, C.-C. Chou and T.-L. Wu, “EMI Reduction Control Based on 8b/10b,” 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 609-613, Reno, NV, USA, 2020
C.-K. Chan et al., “Power Distribution Network Modeling and Design of Re-Distribution Layer in DDR Application,” 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI), 1-4, Cologne, Germany, 2020
C.-W. Ting, S. Chen and T.-L. Wu, “A Cost-efficient Air-Filled Substrate Integrated Ridge Waveguide for mmWave Application,” 2020 IEEE/MTT-S International Microwave Symposium (IMS), 165-168, Los Angeles, CA, USA, 2020
R.-J. Liu, C.-C. Chou and T.-L. Wu, “An Improved Method of Finding Complex Permittivity of Lossy Liquids,” 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, Shenzhen, China, 2020
P.-Y. Weng et al., “Enhanced Power and Signal Integrity Through Layout Optimization of High-Speed Memory Systems,” 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, KAOHSIUNG, Taiwan, Dec. 2019
C.-W. Ting, K.-C. Chen, S. Chen and T.-L. Wu, “A mm-Wave Low-Loss Transition from Microstrip Line to Air-Filled Substrate Integrated Wavguide on Printed Circuit Board Technology,” 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, KAOHSIUNG, Taiwan, Dec. 2019
H.-W. Liu, C.-H. Cheng, and T.-L. Wu, “Miniaturized Quarter-Wavelength Resonator for Common-Mode Filter Based on Pattern Ground Structure,” 2019 EMC Sapporo/APEMC, 816-819, Sapporo, Japan, 2019
P.-J. Li, C.-C. Chou, and T.-L. Wu, “Modeling of Radiated Emission caused by Coaxial-to-microstrip Transition,” 2019 International Conference on Electromagnetics in Advanced Applications (ICEAA), 0245-0249, Granada, Spain, 2019
P.-Y. Weng et al., “Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems,” 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 1-3, Montreal, QC, Canada, 2019
C.-H. Cheng and T.-L. Wu, “A Common-Mode Filter with Three Alterable and Designable Transmission Zeroes,” International Symposium on Electromagnetic Compatibility (EMC EUROPE), pp. 429-432, Amsterdam, Netherlands, Aug. 2018
C.-Y. Lin and T.-L. Wu, “Investigation on Degradation of Common Mode Noise Suppression with Electrostatic Discharge Protection Array,” International Symposium on Electromagnetic Compatibility (EMC EUROPE), pp. 463-466, Amsterdam, Netherlands, Aug. 2018
M.-H. Tsai, S.-K. Hsu, C.-K. Shen, P.-S. Wei, C.-H. Chern and T.-L. Wu, “A Miniature Electromagnetic Bandgap Structure Using Integrated Fan-Out Wafer-Level Package (InFO-WLP) for Gigahertz Noise Suppression,” IEEE/MTT-S International Microwave Symposium - IMS, pp. 1542-1544, Philadelphia, PA, Jun. 2018
P. J. Li and T. L. Wu, “An eye diagram improvement method using simulation annealing algorithm,” IEEE 22nd Workshop on Signal and Power Integrity (SPI), Brest, France, May 2018
Y. T. Lin, C. H. Cheng, and T. L. Wu, “Fast and accurate yield rate prediction of PCB embedded common-mode filter with artificial neural network,” IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibil, pp. 542-545, Singapore, May 2018
L. H. Yen et al., “Modularized prototype of 5G mmWave base station system at 38 GHz,” IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibil, pp. 396-398, Singapore, May 2018
C.-K, Chan, T.-M. Wu, M.-L. Wu, G.-J. Fan, C. Shiah, C.-C. Lu, and T.-L. Wu, “Signal/Power Integrity Co-Simulation of DDR3 Memory Module,” IEEE International Conference on Computational Electromagnetics (ICCEM), Chengdu, Mar. 2018
P.-Y. Weng, C.-H. Chen, C.-H. Chen, C.-L. Liao, T.-L. Wu, and B. Mutnury, “Factors Affecting Near-End Crosstalk (NEXT) in High Speed Serial Links,” 2018 15th International Conference on ElectroMagnetic Interference & Compatibility (INCEMIC), 1-4, India, 2018
S. Chen and T.-L. Wu, “A Power Divider with Controllable Transmission Zeros Using Lumped Artificial Transmission Line,” 2018 Asia-Pacific Microwave Conference (APMC), 1097-1099, Kyoto, 2018
T.-Y. Lin and T.-L. Wu, “Compact Quasi-Elliptic Bandpass Filter Using Magnetically Coupled LC Resonator Pair,” 2018 Asia-Pacific Microwave Conference (APMC), 1354-1356, Kyoto, 2018
S. Chen, C. Chen, C. L. Liao, J. Chen, T. L. Wu and B. Mutnury, “Via optimization for next generation speeds,” IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, Oct. 2017
P. J. Li and T. L. Wu, “A super broadband DGS-based common-mode filter with a compact dimension,” IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, Oct. 2017
Y. C. Huang, C. Y. Lin and T. L. Wu, “A simple method to improve signal integrity of electrostatic discharge protection devices,” IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, Oct. 2017
C. H. Cheng and T. L. Wu, “A modal-analysis-based prediction method for radiation power in differential channels with discontinuity,” International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France, Sept. 2017
C.-Y. Lin and T.-L. Wu, “Electrostatic discharge protection device and common mode suppression circuit on printed circuit board codesign,” IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), pp. 772-775, Washington, DC, Aug. 2017
C.-C. Chou and T.-L. Wu, “EMI-reduction coding based on 8b/10b,” IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), pp. 373-376, Washington, DC, Aug. 2017
C. K. Shen, T. L. Wu, T. M. Shen, C. Y. Hsiao, T. K. Wang and K. Y. Chen, “An efficient partition analysis for electromagnetic interference estimation of high-speed input/output differential interfaces,” IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), pp. 195-197, Seoul, South Korea, May 2017
Z.-M. Tsai, R.-B. Wu, T.-L. Wu, S.-Y. Chen, S.-G. Mao and T.-G. Ma, “The competitions of electromagnetic for undergraduate students in Taiwan: Taiwan creative electromagnetic implementation competition T-CEIC,” IEEE International Conference on Computational Electromagnetics (ICCEM), pp. 86-88, Kumamoto, Japan, Mar. 2017
T.-Y. Lin and T.-L. Wu, “Balanced Bandpass Filter With Reflectionless common-mode Suppression,” IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), pp. 17-19, Honolulu, HI, Dec. 2016
C.-W. Lin, C.-K. Shen and T.-L. Wu, “Design and Modeling of an Absorptive Frequency Selective Surface with Several Transmissive Bands,” IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), pp. 33-35, Honolulu, HI, Dec. 2016
C.-Y. Lin and T.-L. Wu, “E shape resonator dualband common mode filter,” IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS), pp. 21-24, San Diego, CA, Oct. 2016
C.-Y. Liu, C.-K. Shen, S.-Y. Chen, T.-L. Wu, J.-J. Chang, B.-C. Tseng, and J. Yen, “Study of Frequency Offset Behavior for Artificial Magnetic Structure in Compact Mobile Device,” IEEE International Symposium on Antennas and Propagation (APSURSI), pp. 1915-1916, Fajardo, Puerto Rico, Jun. 2016
S. Chen, W.-C. Lee, and T.-L. Wu, “A Balanced-to-Balanced Power Divider with Common-Mode Noise Absorption,” IEEE MTT-S International Microwave Symposium (IMS), San Francisco, CA, May 2016
Y.-A. Hsu, C.-C. Chou, C.-H. Cheng, and T.-L. Wu, “A Radiation Prediction Method based on Partial Element Equivalent Circuit,” IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), pp. 706-708, Shenzhen, May 2016
P.-J. Li, C.-H. Cheng, Y.-C. Tseng, and T.-L. Wu, “Novel Absorptive Design of Common-Mode Filter at Desired Frequency Band,” IEEE 20th Workshop on Signal and Power Integrity (SPI), Turin, Italy, May 2016
P.-J. Li, Y.-C. Tseng and T.-L. Wu, “Radiation mechanism and solution of cable attached differential signals,” IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), pp. 430-432, Shenzhen, May 2016
W.-Y. Hsu, C.-K. Shen, T.-L. Wu, Ch.-H. Chen, and D.-H. Han, “Post-fabricated EBG Tape on Electronic Devices for RFI Mitigation in WLAN Bands,” IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, Seoul, South Korea, Dec. 2015
C. H. Chen, Y. C. Tseng , I C. Lin , C. C. Fu, K. H. Liao and T. L. Wu, “Prediction of near-field shielding effectiveness for conformal-shielded SiP and measurement with magnetic probe,” IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 77-79, San Jose, CA, USA, Oct. 2015
Y. A. Hsu, C. H. Cheng, Y. C. Lu and T. L. Wu, “A Prediction Method of Heat Generation in the Silicon Substrate for 3-D ICs,” IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 89-92, San Jose, CA, USA, Oct. 2015
C.-K. Shen, and T.-L. Wu, “Compact Hybrid Open Stub EBG Structure for Power Noise Suppression in WLAN Band,” in Proc. Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe, Dresden, Germany, Aug. 2015
Y.-M. Yu, C.-N. Chiu, Y.-P. Chiou, and T.-L. Wu, “Suppression of End-fired Emission for a Miniaturized-Element Frequency-Selective Shielding Surface with Finite Size Using EBG,” in Proc. IEEE. Int. Symp. Electromagn. Compat., Dresden, Germany, Aug. 2015
Y.-C. Tseng, P.-Y. Weng, and T.-L. Wu, “Compact Wideband Balanced Filter for Eliminating Radio-Frequency Interference on Differentially-fed Antennas,” in Proc. Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe, Dresden, Germany, Aug. 2015
C.-H. Cheng, and T.-L. Wu, “Effective Current Distribution Analysis Method for Multiconductor-Transmission-Line (MTL) System with Arbirary Conductor Number Variation,” in Proc. Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe, Dresden, Germany, Aug. 2015
Y.-M. Yu and T.-L. Wu, “A Via-Based Methodology for Frequency Selective Surface Minimization,” in Proc. IEEE Int. Symp. Antennas Propag., Vancouver , Canada, Jul. 2015
C.-K. Shen, M.-H. Tsai, H.-N. Chen, C.-P. Jou, Sally Liu, F.-L. Hsueh, and T.-L. Wu, “Design of On-Chip Microwave Filters in Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology,” in Proc. Asia-Pacific Int. Symp. Electronmagn. Compat., Taipei, Taiwan, May 2015
C.-Y. Lin, Y.-C. Huang, and T.-L. Wu, “Tri-Section Quarter Wavelength Resonator Common Mode Filter,” in Proc. Asia-Pacific Int. Symp. Electronmagn. Compat., Taipei, Taiwan, May 2015
Y.-J. Lin, Y.-C. Tseng, C.-Y. Hsiao and T.-L. Wu, “A SMD-Type Filter Solution for EMI/RFI Mitigation on High-Speed Digital Interfaces and Its Application,” in Asia-Pacific Symp. Electromagn. Compat., Taipei, Taiwan, May 2015
C.-H. Chen, Y.-C. Tseng, I-C. Lin, C.-C. Fu, and T.-L. Wu, “Transmission-Line Based Modeling for Conformal Shielding in Advanced System-in-Package (SiP),” in Asia-Pacific Symp. Electromagn. Compat., Taipei, Taiwan, May 2015
C.-H. Cheng, and T.-L. Wu, “A Compact Dual-Band Common-Mode Filtering Component for EMC in Wireless Communication,” in Asia-Pacific Symp. Electromagn. Compat., Taipei, Taiwan, May 2015
C.-H. Hung, C.-Y. Hsiao, and T.-L. Wu, “A novel common-mode filter (CMF) design based on signal interference technique,” in Proc. IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), pp. 125-128, Bangalore, India, Dec. 2014
S.-K. Hsu, C.-C. Tseng, and T.-L. Wu, “Miniaturization technique for forward-wave directional couplers by using open stubs and patterned ground structures,” in Proc. Asia-Pacific Microw. Conference (APMC), Sendai, Japan, Nov. 2014
H. Wang, T.-L. Wu, P. Hsu, R.-B. Wu, K.-Y. Lin, and T.-W. Huang, “Recent progress of advanced microwave and system-in-package integration technologies at National Taiwan University,” in Proc. Asia-Pacific Microw. Conference (APMC), Sendai, Japan, Nov. 2014
C.-C. Chou and T.-L. Wu, “Statistical eye diagram prediction for a 8b10b-coded channel using pulse response,” in Proc. IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 43-46, Portland, USA, Oct. 2014
H.-C. Chen, T.-L. Wu, S. Connor, and B. Archambeault, “Fast prediction of radiation from high-speed/high-density connectors,” in Proc. IEEE. Int. Symp. Electromagn. Compat., pp. 256-259, Raleigh, NC, Aug. 2014
C.-K. Shen, T.-L. Wu, C.-H. Chen, and D.-H. Han, “Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression,” in Proc. IEEE. Int. Symp. Electromagn. Compat., pp. 357-361, Raleigh, NC, Aug. 2014
S.-Y. Hsu, C.-C. Chou, and T.-L. Wu, “Signal integrity: Influence of non-linear driver, different bit rates, and estimation by different algorithms,” in Asia-Pacific Symp. Electromagn. Compat., pp. 121-124, Tokyo, May 2014
C.-Y. Hsiao, S.-H. Wang, C.-C Wang, W.-S. Wang, Y.-H. Lin,and T.-L. Wu, “Radio-Frequency Interference Mitigation Strategies for High-Speed Connectors,” in Proc. Elect. Design Adv. Packag. Systems Symp., pp. 1-4, Nara, Japan, Dec. 2013
C.-H. Cheng and T.-L. Wu, “A novel common-mode filter for multiple differential pairs with low crosstalk and low mode conversion level,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 259-262, San Jose, CA, Oct. 2013
H.-C. Chen, S. Connor, T.-L. Wu, and B. Archambeault, “The effect of various skew compensation strategies on mode conversion and radiation from high-speed connectors,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 328-332, Denver, USA, Aug. 2013
Y.-C. Tseng, P.-S. Chen, W.-C. Lo, S.-H. Wu, and T.-L. Wu, “Compact TSV-based wideband bandpass filters on 3-D IC,” in Proc. IEEE 63rd Electronic Components and Technology Conf., pp. 2083-2088, Nevada, USA, Mar. 2013
C.-K. Shen, Y.-C. Lu, Y.-P. Chiou, T.-Y. Cheng, and T.-L. Wu, “Power distribution network modeling for 3-D ICs with TSV arrays,” 18th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 17-22, Yokohama, Japan, Jan. 2013
Y.-C. Tseng, C.-B. Chang, C.-K. Tang, C.-H. Cheng, Y.-C. Lu, K.-Y. Lin, T.-L. Wu, and R.-B. Wu, “Design considerations for radio frequency 3DICs,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., pp. 197-200, Taipei, Taiwan, Dec. 2012
K.-Y. Chen, Y.-A. Sheu, C.-H. Cheng, J.-H. Lin, Y.-P. Chiou, and T.-L. Wu, “A novel TSV model considering nonlinear MOS effect for transient analysis,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., pp. 49-52, Taipei, Taiwan, Dec. 2012
J.-H. Lin, H.-P. Chang, T.-L. Wu, and Y.-P. Chiou, “3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., pp. 181-184, Taipei, Taiwan, Dec. 2012
T.-H. Lin, J.-C. Yen, S.-K. Hsu, and T.-L. Wu, “A novel compact 3-dB forward-wave directional coupler with periodic capacitive enhancement,” in Proc. Asia-Pacific Microw. Conf., pp. 983-985, Kaohsiung, Taiwan, Dec. 2012
T.-W. Weng and T. -L. Wu, “A novel miniaturized bandstop filter using defected ground on system in package (SiP),” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 296-298, Tempe, AZ, Oct. 2012
Y.-J. Chang, H.-H. Chuang, Y.-C. Lu, Y.-P. Chiou, P.-S. Chen, S.-H. Wu, T.-Y. Kuo, C.-J. Zhan, W.-C. Lo, and T.-L. Wu, “Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: experimental validation and application to faraday cage design,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 232-235, Tempe, AZ, Oct. 2012
C.-C. Chou, H.-H. Chuang, S.-H. Weng, C.-K. Cheng, and T.-L. Wu, “Eye prediction of digital driver with power distribution network noise,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 131-134, Tempe, AZ, Oct. 2012
Y.-J. Cheng, H.-H. Chuang, and T.-L. Wu, “A Novel Dual-Functional Structure Integrating Differential-Mode Equalizer with Common-Mode Filter for Gbps Signaling,” in Proc. IEEE Eur. Electromagn. Compat. Conf., pp. 1-5, Rome, Italy, Sept. 2012
T.-Y. Zheng, H.-H. Chuang, C.-D. Wang, P.-S. Chen, T.-Y. Kuo, C.-J. Zhen, S.-H. Wu, W.-C. Lo, Y.-C. Lu, Y.-P. Chiou, and T.-L. Wu, “Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer,” in Proc. 2012 IEEE 62nd Electronic Components and Technology Conf., pp. 1934-1938, San Diego, CA, USA, Jun. 2012
Y.-J. Chang, C.-C. Chou, H.-H. Chuang, and T.-L. Wu, “A new solution and its estimation method for slot-crossing signals to reduce ISI-increased crosstalk,” in Asia-Pacific Symp. Electromagn. Compat., pp. 622-626, Singapore, May 2012
T.-H. Lin, S.-K. Hsu, and T.-L. Wu, “A novel broadband forward-wave directional coupler design with periodical H-shaped structure,” in Proc. Asia-Pacific Microw. Conf., pp. 1770-1773, Melbourne, Australia, Dec. 2011
S.-K. Hsu, T.-H. Lin, and T.-L. Wu, “Size-reduction of 3 dB microstrip forward-wave coupler using defected ground structure,” in Proc. Asia-Pacific Microw. Conf., pp. 1774-1777, Melbourne, Australia, Dec. 2011
J.-C. Yen, S.-K. Hsu, and T.-L. Wu, “A novel compact backward-wave directional coupler desigh with defected ground structure,” in Proc. Asia-Pacific Microw. Conf., pp. 1150-1153, Melbourne, Australia, Dec. 2011
Y.-J. Cheng, H.-H. Chuang, and T.-L. Wu, “A physics-based model of on-chip decoupling capacitor for accurate power integrity analysis,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., Hangzhou, China, Dec. 2011
C.-H. Tsai, H.-C. Chen, and T.-L. Wu, “A broadband and miniaturized balun on system-in-package (SiP),” in Proc. IEEE IMPAC., pp. 103-106, Taipei, Taiwan, Oct. 2011
H.-H. Chuang and T.-L. Wu, “A novel and low-cost method for slot-crossing differential line to reduce GHz common-mode radiation in advanced PCB,” in Proc. IEEE IMPAC., Taipei, Taiwan, Oct. 2011
J.-C. Yen, S.-K. Hsu, and T.-L. Wu, “A novel miniaturized forward-wave directional coupler loaded with periodic shunt inductors,” in Proc. Eur. Microw. Conf., pp. 782-785, Manchester, United Kingdom, Oct. 2011
Y.-L. Song, C.Yu, F.-C. Chuang, Y.-C. Tseng, J.-Y. Zou, S.-K. Hsu, T.-G. Ma, T.-L. Wu, and L.-M. Chang, “Analysis 2.5-D permutation power transmission line to decrease electro-magnetic influence at high technology nano-fab,” in Int. Conf. Energy, Environ., Sustainable Develop., Oct. 2011
Y.-L. Song, C.Yu, F.-C. Chuang, Y.-C. Tseng, J.-Y. Zou, S.-K. Hsu, T.-G. Ma, T.-L. Wu, and L.-M. Chang, “Optimal permutation of power transmission line at high technology nano-fab to decrease electromagnetic influence,” in Annu. Symp. Antenna Meas. Tech. Association, Oct. 2011
T.-Y. Cheng, C.-D. Wang, Y.-P. Chiou, and T.-L. Wu, “Accuracy-improved through-silicon-via model using conformal mapping technique,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 189-192, San Jose, USA, Oct. 2011
C.-Y. Hsiao, C.-H. Huang, C.-D. Wang, K.-H. Liao, C.-H. Shen, C.-C. Wang, and T.-L. Wu, “Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules,” in Proc. IEEE. Int. Symp. Electromagn. Compat., pp. 341-344, California, USA, Aug. 2011
H.-H. Chuang and T.-L. Wu, “A novel and cost-effective method to suppress GHz common-mode radiation for slot-crossing differential lines,” in Proc. IEEE. Int. Symp. Electromagn. Compat., pp. 720-723, California, USA, Aug. 2011
H.-C. Chen and T.-L. Wu, “Suppression of RF interference using balanced filter in communication system,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 564-568, California, USA, Aug. 2011
C.-H. Tsai, J.-Z. Hsu, I.-I. A. Ieong, and T.-L. Wu, “A novel common mode choke and its application for 5 Gbps USB 3.0,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 888-891, California, USA, Aug. 2011
C.-D. Wang and T.-L. Wu, “Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 715-719, California, USA, Aug. 2011
F.-C. Chuang, Y.-L. Song, C. Yu, S.-K. Hsu, T.-L. Wu, and L.-M. Chang, “Active field canceling system in next generation nano-fab,” in Int. Conf. Power Electron. Systems Applications, Jun. 2011
Y.-L. Song, C. Yu, F.-C. Chuang, Y.-C. Tseng, J.-Y. Zou, S.-K. Hsu, T.-G. Ma, T.-L. Wu, and L.-M. Chang, “Evaluation of magnetic field from varied permutation power transmission line at high technology nano-fab,” in Int. Conf. Power Electron. Systems Applications, Jun. 2011
F.-C. Chuang, Y.-L. Song, C. Yu, S.-K. Hsu, T.-L. Wu, and L.-M. Chang, “Magneto-resistive sensor readout circuit and field canceling system in next generation nano-fab,” in Proc. Asia-Pacific Int. Symp. Electronmagn. Compat., May 2011
S.-K. Hsu, J.-C.Yen, and T.-L. Wu, “A novel microstrip forward directional coupler using defected ground structure,” in Asia-Pacific Microw. Conf., pp. 794-797, Yokohama, Japan, Dec. 2010
C.-H. Huang, C.-Y. Hsiao, C.-D Wang, T. Chen, K.-H. Liao, and T.-L. Wu, “Conformal shielding investigation for SiP modules,” in Proc. Elect. Design Adv. Packag. Systems Symp., pp. 1-4, Singapore, Dec. 2010
Y.-H. Hsu, C.-H. Tsai, and T.-L. Wu, “A new bandastop filter uisng artificial defected ground structures with,” in Proc. Elect. Performance Electron. Packag. Systems, pp. 89-92, Austin, USA, Oct. 2010
S.-K. Hsu and T.-L. Wu, “A novel microstrip forward directional coupler based on an artificial substrate,” in Proc. Eur. Microw. Conf., pp. 926-929, Paris, France, Sept. 2010
C.-D. Wang and T.-L. Wu, “A stopband enhanced EBG power/ground plane based on via location design,” in Proc. IEEE Compon. Packag. Manuf. Technol. Symp. Japan, Tokyo, Japan, Aug. 2010
H.-H. Chuang and T.-L.Wu, “A new common-mode EMI suppression technique for GHz differential signals crossing slotted reference planes,” in Proc. IEEE. Int. Symp. Electronmagn. Compat., pp. 12-15, Folorida, USA, Jul. 2010
I.-I. A. Ieong, C.-H. Tsai, and T.-L. Wu, “An ultra compact common-mode filter for RF interference control in 3G wireless communication systems,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 776-779, Folorida, USA, Jul. 2010
C.-H. Cheng, C.-H. Tsai, and T.-L. Wu, “A novel time domain method to extract equivalent circuit model of patterned ground structures,” in Asia-Pacific Symp. Electromagn. Compat., pp. 622-626, Beijing, China, Apr. 2010
A. C. Scogna, C.-D. Wang, A. Orlandi, and T.-L. Wu, “Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure,” in Asia-Pacific Symp. Electromagn. Compat., pp. 158-161, Beijing, China, Apr. 2010
H.-H. Chuang, C.-J. Hsu, M.-Z. Hong, D. Hsu, R. Huang, L.-C. Hsiao, and T.-L. Wu, “Signal/power integrity design strategy for low-cost package of high-speed memory I/O interfaces,” in Proc. IEEE Electron. Design Adv. Packag. Systems Symp., pp. 1-4, Hong Kong, China, Dec. 2009
C.-H. Tsai and T.-L. Wu, “A GHz common-mode filter using negative permittivity metamaterial on low temperature co-fire ceramic (LTCC) substrate,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 91-94, Austin, USA, Aug. 2009
C.-H. Tsai and T.-L. Wu, “A metamaterial-typed differential transmission line with broadband common-mode suppression,” in Proc. IEEE Int. Symp. Electromagn. Compat. Eur. Workshop, Jun. 2009
H.-H. Chuang, T.-L. Wu, and T.-K. Wang, “Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package,” in Asia-Pacific Microw. Conf., Hong Kong, Dec. 2008
H.-H. Chuang, S.-J. Wu, M.-Z. Hong, D. Hsu, R. Huang, and T.-L. Wu, “Power integrity chip-package-PCB co-Simulation for I/O interface of DDR3 high-speed memory,” in Proc. Elect. Design Adv. Packag. Systems Symp., pp. 31-34, Seoul, Dec. 2008
C.-Y. Hsieh, H.-H. Chuang, T.-K. Wang, C.-C. Wang, H.-H. Cheng, Y.-S. Wu, C.-T. Chiu, C.-P. Hung, and T.-L. Wu, “A novel stopband-enhanced EBG planes using an embedded slow-wave structure,” in Proc. Elect. Performance Electron. Packag. Systems, pp. 131-133, Oct. 2008
S.-J. Wu, H.-H. Chuang, T.-K. Wang, and T.-L. Wu, “A novel HU-shaped common-mode filter for GHz differential signals,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 1-4, Aug. 2008
C.-H. Shih, G.-H. Shiue, T.-L. Wu, and R.-B. Wu, “The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes,” in Asia-Pacific Symp. Electromagn. Compat., pp. 164-167, Singapore, May 2008
T.-K. Wang, T.-W. Han, and T.-L. Wu, “A novel EBG power plane with stopband enhancement using artificial substrate,” in Proc. Elect. Performance Electron. Packag. Systems, pp. 193-196, Atlanta, Georgia, USA, Aug. 2007
Y.-C. Chen, T.-K. Wang, S.-M. Lan, C.-H. Lu, and T.-L. Wu, “Broadband noise suppression using a hybrid photonic crystal power/ground plane substrate,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 1-4, Honolulu, Hawaii, USA, Jul. 2007
H.-C. Kuo, S.-T. Chen, and T.-L. Wu, “Improving the radiated immunity of the strip-lines using a novel hybrid EBG structure,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 223-236, Oct. 2006
S. Sun, D. Pommerenke, J. Drewniak,K. Xiao,S.-T. Chen, and T.-L. Wu, “Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 550-555, Portland, Oregon, USA, Aug. 2006
H.-J. Ou, T.-S. Horng, and T.-L. Wu, “Power splitting analysis of 3×3 photonic crystal ,” Optoelectron. Commun. Conf., Southem Taiwan Opto-Electronics Center of Excellence National Su, Jul. 2006
S.-T. Chen, T.-S. Horng, and T.-L. Wu, “Photonic crystal pwer substrate for wideband suppression of power/ground bounce noise and radiated emission in high-speed packages,” in Asia-Pacific Symp. Electromagn. Compat., vol. 1, pp. 498-500, Taipei, Taiwan, Dec. 2005
H.-C. Kuo, S.-T. Chen, C.-C. Wang, S.-W. Wen, H.-C. Li, C.-C. Chien, and T.-L. Wu, “High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure,” in Asia-Pacific Symp. Electromagn. Compat., vol. 1, pp. 117-120, Taipei, Taiwan, Dec. 2005
J.-S. Chiang and T.-L. Wu, “Polarization beam splitting in twin- elliptical-core photonic crystal fiber coupler,” in Int. Symp. Commun., Kaohsiung, Taiwan, Nov. 2005
H.-J. Ou, T.-S. Horng, and T.-L. Wu, “A modified FDTD procedure for computing the electromagnetic bandgap (EBG) structure,” in Int. Conf. Electromagn. Applications Compat., Taipei, Taiwan, Oct. 2005
T.-K. Wang, C.-C. Wang, S.-T. Chen, Y.-H. Lin, and T.-L. Wu, “A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 917-920, Chicago, USA, Aug. 2005
H.-J. Ou and T.-L. Wu, “Analysis and solution of modes loss problem for computing the bandgap structure of periodic structures by 2-D FDTD method,” Int. Conf. Antennas, Radar, Wave Propag., Banff, Alberta, Canada, Jul. 2005
C.-C. Wang, S.-M. Wu, C.-H. Chou, C.-W. Tsai, T.-K. Wang, Y.-H. Lin, S.-T. Chen, and T.-L. Wu, “A novel embedded power plane with 10GHz stopband for simultaneous switching noise,” in Proc. Electron. Compon. Technol. Conf., p.p. 769-771, Orlando, Jun. 2005
T.-K. Wang, C.-C. Wang, Y.-H. Lin, and T.-L. Wu, “A new electromagnetic bandgap power plane with super-broadband suppression of ground bounce noise in high speed circuits,” In Int. Conf. Electromagn. Application Compat., Taipei, Oct. 2004
S.-T. Chen, C.-W. Tsai, S.-M. Wu, C.-P. Hung, and T.-L. Wu, “Chip-level model of switching noise coupling on integrated system combining package and printed circuit board,” in Proc. IEEE Int. Symp. Electromagn. Compat. Eur. Workshop, vol. 1, pp. 420-424, Eindhoven, Netherland, Sept. 2004
Y.-H. Lin and T.-L. Wu, “Analysis of radiation caused by SSN and transmission line by combining the equivalent circuits of active IC into FDTD,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 277-282, Santa Clara,USA, Aug. 2004
T.-L. Wu, W.-C. Hung, C.-H. Lee, C.-W. Lin, W.-S. Jou, and W.-H. Cheng,, “A low-cost plastic package for 2.5Gbps optical transceiver module with high electromagnetic shielding,” in Proc. Electron. Compon. Technol. Conf., vol. 1, pp. 199-202, Jun. 2004
J.-S. Chiang and T.-L. Wu, “A novel periodic structures in photonic crystal fibers,” in Pacific Rim Conf. Lasers Electro-Optics, vol. 1, pp. 17, Taipei, Dec. 2003
C.-H. Chao and T.-L. Wu, “Photonic crystal fiber analysis through vector boundary-element method,” in Pacific Rim Conf. Lasers Electro-Optics, vol. 2, pp. 100, Taipei, Dec. 2003
C.-H. Chao and T.-L. Wu, “Polarization and dispersion analysis of holey fibers with elliptical air holes through the vector boundary-element method,” in Annu. Meeting Lasers Electro-Optics Society, vol. 2, pp. 900-902, Tucson, USA, Oct. 2003
S.-T. Chen, C.-W. Tsai, S.-M. Wu, C.-P. Hung, and T.-L. Wu, “Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB),” in Taiwan Electromagn. Compat. Conf., vol. 1, pp. 64-68, Oct. 2003
W.-H. Cheng, T.-L. Wu and W.-S. Jou, “Electromagnetic shielding of plastic packaging in cost-effective optical transceiver modules,” in Annu. Meeting Lasers Electro-Optics Society, vol. 2, pp. 565-566, Tucson, USA, Oct. 2003
C.-C. Kuo and T.-L. Wu, “ Time-domain SPICE model for coupled interconnects using the multi-conductor layer peeling technique,” in Int. Zurich Symp. Technical Exhibit. Electromagn. Compat., vol. 1, pp. 5-10, Feb. 2003
H.-C. Chang, C.-C. Kuo, and T.-L. Wu, “A time-domain approach to extract SPICE-compatible equivalent models for embedded interconnects,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 2, pp. 834 -839, Minnesota,USA, Aug. 2002
L.-R. Chen, Y.-H. Lin, and T.-L. Wu, “NSTL evaluation of the compact EMC chamber with ferrite tiles being partially lined on the floor ground,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 2, pp. 958-963, Minnesota,USA, Aug. 2002
J.-N. Hwang and T.-L. Wu, “Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 2, pp. 733-736, Minnesota,USA, Aug. 2002
L.-R. Chen, Y.-H. Lin, and T.-L. Wu, “NSTL evaluation of the compact EMC chamber with absorbers being partially lined on the floor ground,” in Electromagn. Compat. Conf., pp. 343-345, Taipei, Taiwan, Oct. 2001
Y.-H. Lin and T.-L. Wu, “Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 1, pp. 319-324, Montreal, Canada, Aug. 2001
J.-N. Hwang and T.-L. Wu, “The bridging effect of the isolation moat on the EMI caused by ground bounce noise between power/ground planes of PCB,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 1, pp. 471-474, Montreal, Canada, Aug. 2001
C.-C. Kuo, Y.-H. Lin, and T.-L. Wu, “Crosstalk characterization of high-speed interconnects in time-domain,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 1, pp. 657-660, Montreal, Canada, Aug. 2001
S.-K. Chiu, J.-Y. Cheng, W.-S. Jou, S.-C. Wang, C.-M. Wang, C.-S. Lin, T.-L. Wu, and W.-H. Cheng, “Electromagnetic shielding of plastic packaging in laser diode modules,” in Proc. Electron. Compon. Technol. Conf., Florida, USA, May 2001
S.-K. Chiu, J.-Y. Cheng, W.-S. Jou, S.-C. Wang, C.-M. Wang, C.-S. Lin, T.-L. Wu, and W.-H. Cheng, “Electromagnetic shielding of plastic material in laser diode modules,” in Int. Photon. Conf., Hsichu, Taiwan, Dec. 2000
C.-H. Chao and T.-L. Wu, “Investigation of the coupling characteristics for the 4 x 4 single-mode fused fiber couplers,” in Int. Photon. Conf., Hsichu, Taiwan, R.O.C, Dec. 2000
T.-L. Wu, “Vectorial analysis for polarization effect of wavelength-flattened fiber-optic couplers,” in Int. Photon. Conf., Hsichu, Taiwan, R.O.C, Dec. 2000
J.-J. Lin and T.-L. Wu, “FDTD modeling of the coaxial effect on the measurement of ground bounce in the high speed digital PCB,” in Proc. IEEE Int. Symp. Electromagn. Compat., Washington DC, Aug. 2000
T.-L. Wu, “Rigorous analysis of fiber-core effect for fused fiber-optic couplers,” in IEEE Inter. Symp. Antenna Propag. URSI, Orlando, Florida, Jul. 1999
T.-L. Wu and H.-C. Chang, “Rigorous analysis of polarization effect of wavelength-flattened fused fiber-optic couplers,” in Progress in Electromagn. Research Symp., 1999
S.-C. Chao and T.-L. Wu, “Bypass capacitance effect both on the signal integrity and electromagnetic radiation for high-speed clock circuits,” Progress Electromagn. Research Symp., 1999
H.-C. Chang, C.-W. Wu, T.-L. Wu, S.-W. Yang, and G.-J. Liao, “Fabrication and electromagnetic modeling of fiber-optic coupling devices based on weakly fused tapered structure,” in Taiwan Optoelectron. Ind. Technol. Develop. Conf., Hsinchu, Taiwan, R.O.C, Jul. 1997
H.-C. Chang, T.-L. Wu, and C.-W. Wu, “Three-dimensional modeling of fused biconical optical fiber coupling devices,” in Progress Electromagn. Research Symp., Seattle, Washington, Jul. 1995
T.-L. Wu, C.-W. Wu, and H.-C. Chang, “Simulation of polarization and spectral responses of fused tapered fiber-optic couplers,” In Int. Conf. Integr. Opt. Optical Fibre Commun., Hong Kong, Jun. 1995
T.-L. Wu and H.-C. Chang,, “Form birefringence of biconical-taper fiber-optic couplers under weakly fused condition,” in Topical Meeting Integr. Photon. Research, Dana Point, California, Feb. 1995
T.-L. Wu and H.-C. Chang, “A novel dispersion calculation method for elliptical-core fiber-optic dispersion compensators,” in Int. Symp. Commun., National Taiwan University, Taipei, Taiwan, R.O.C, Feb. 1995
T.-L. Wu and H.-C. Chang, “A vectorial simulation model for fused tapered optical couplers,” in Topical Meeting Integr. Photon. Research, San Francisco, California, Feb. 1994
Books:
Tzong-Lin Wu and Chiu-Chih Chou, “Chp.16: Differential-Mode Equalizers with Common-Mode Filtering, in Ferran Martin, Lei Zhu, Jiasheng Hong, Francisco Medina, Editor, Balanced Microwave Filters,” Wiley-IEEE Press, Mar. 2018
Melinda Piket-May, Wojciech K. Gwarek, Tzong-Lin Wu, Bijan Houshmand, Tatsuo Itoh, and J. J. Simpson, “Chp.15: High-Speed Electronic Circuits With Active and Nonlinear Components in A. Taflove and S. Hagness, Editor, Computational Electrodynamics: The Finite-Diffeernce Time-Domain Method (3rd Edition),” Jun. 2005
Tzong-Lin Wu and Shu-Jung Wu, “Common mode filtering method and device,” US 7,932,793 B2, Apr. 2010
Kuo-Ching Steven Hsu, Chien-Min Lin, Guan-Tzong Wu, Tzong-Lin Wu, “Capacitors with insulating layer having embedded dielectric rods,” US 7,679,926, Mar. 2010
吳宗霖,王挺光,陳信廷,王建中,王陳肇, 歐宏俊,吳松茂,蔡志偉, 周佳興, “抑制雜訊之內嵌電源平面及包含該電源平面之多層結構,” 中華明國 296493, May 2008
Tzong-Lin Wu and Chia-Hsin Chao, “Broadband ultra-flattened dispersion micro-structured fiber,” US 7184637 B2, Feb. 2007
Tzong-Lin Wu, Yen-Hui Lin, Sing-Ting Chen, Ting-Kuang Wang, “Power plane system of high-speed digital circuit for suppressing ground bounce noise,” US 7148425 B2, Dec. 2006
Structure and method for reducing em radiation, and electric object and manufacturing method thereof, “Tzong-Lin Wu, Hao-Hsiang Chuang,” US 8,554,075 B2
Tzong-Lin Wu, Chung-Hao Tsai, “Filtering device and differential signal transmission circuit capable of suppressing common-mode noises upon transmission of a differential signal,” US 8,339,212 B2
Yu-Hao Hsu, Chung-Hao Tsai, Tzong-Lin Wu, “Defected ground structure with shielding effect,” US
Iat In Ao Ieong, Chung-Hao Tsai, Tzong-Lin Wu, “Common mode noise suppression circuit,” US
Iat In Ao Ieong, Chung-Hao Tsai, Tzong-Lin Wu, “Common mode noise suppression circuit,” EP