吳宗霖特聘教授的著作列表 - Publication List of Tzong-Lin Wu

Publication List of 吳宗霖 Tzong-Lin Wu

Journal articles & book chapters:

  1. C.-W. Ting and T.-L. Wu, “Millimeter-Wave Narrow-Width Directional Couplers on Via-Free Ridge AFSIW Technology,” IEEE Trans. Compon. Packag. Manuf. Technol., 15(3), 542-552, Mar. 2025
  2. L. -H. Huang, Y. -Y. Cheng and T. -L. Wu, “Analysis and Optimization of HBM3 PPA for TSV Model With Micro-Bump and Hybrid Bonding,” IEEE Trans. Compon. Packag. Manuf. Technol., 15(1), 22-29, Jan. 2025
  3. Y.-Y. Cheng and T. -L. Wu, “Signal Integrity Optimization for C-PHY Channel Using Surrogate Model of Tab-Routing Structure,” IEEE Trans. Electromagn. Compat., 66(6), 2133-2141, Dec. 2024
  4. Y.-Y Cheng, P.-Y. Weng, S.-K. Yang, S.-H. Wu and T.-L. Wu, “Eye Estimation Methods for MIPI C-PHY,” IEEE Trans. Signal Power Integrity., 3, 75-84, May 2024
  5. Y.-R. Chen, Y.-T. Lin and T.-L. Wu, “A Novel Compact Dual-Functional Circuit With Differential-Mode Equalization and Broadband Common-Mode Suppression Using Patterned Ground Plane,” IEEE Trans. Compon. Packag. Manuf. Technol., 14(2), 300-308, Feb. 2024
  6. Y.-C. Chien, H. -W. Liu, C. -C. Chou and T. -L. Wu, “An Embedded Common-Mode Filter and Mixed-Mode Scattering Parameters for the MIPI C-PHY Interface,” IEEE Trans. Electromagn. Compat., 66(1), 143-152, Feb. 2024
  7. L.-C. Huang and T.-L. Wu, “Theory-based Contour Plot Analysis for Optimized Power Delivery Network Noise Absorber,” IEEE Trans. Signal Power Integrity., 2, 134-144, Oct. 2023
  8. S. Chen and T. -L. Wu, “A Miniaturized Balanced-to-Balanced Power Divider with Common-Mode Noise Absorption,” IEEE Trans. Compon. Packag. Manuf. Technol., 13(10), 1673-1684, Oct. 2023
  9. C. -W. Ting, H. -W. Liu, C. -H. Liao, C. -C. Lee and T. -L. Wu, “A Low-Loss Via-Free Ridge Air-Filled Substrate Integrated Waveguide on Printed Circuits Board for mmWave Application,” IEEE Trans. Compon. Packag. Manuf. Technol., 13(9), 1451-1460, Sept. 2023
  10. L.-C. Huang and T.-L. Wu, “Design and Analysis of Broadband Power Delivery Network Noise Absorber for Parallel-Plate Mode Suppression,” IEEE Trans. Microw. Theory Techn., 71(4), 1677-1686, Apr. 2023
  11. P.-Y. Weng, C.-L. Liao, Bhyrav Mutnury and T.-L. Wu, “Optimization of Ground-via Patterns for via Transitions by Minimizing Loop Inductance,” IEEE Trans. Signal Power Integrity., 2, 43-52, Mar. 2023
  12. H.-W. Liu and T. -L. Wu, “A Novel Patterned Ground Structure With Shunt and Series Lumped Elements for Synthesizing Absorption Common-Mode Filters,” IEEE Trans. Electromagn. Compat., 65(1), 195-205, Feb. 2023
  13. Y.-C. Chien, H.-W. Liu and T.-L. Wu, “Reducing the Number of Measurements of a Multiport Circuit Using Covering Designs and Turán Systems,” IEEE Microw. Wireless Technol. Lett., 33(2), 115-117, Feb. 2023
  14. C.-Y. Liu and T.-L. Wu, “Vertically Polarized Planar Transition for Hollow-Dielectric-Waveguide-Based 5G/6G High-Speed mm-Wave Interconnect,” IEEE Microw. Wireless Technol. Lett., 33(1), 7-10, Jan. 2023
  15. Y.-H. Chang, C.-H. Hsieh, S.-P. Cheng, Y. Li, S.S., T. -L. Wu and Z.-M. Tsai, “A 0.6-dB Low Loss and 3-165 GHz Wideband Phase Difference Sub-THz Coupler in 0.18-μm CMOS,” IEEE Microw. Wirel. Compon. Lett., 32(6), 531-534, Jun. 2022
  16. H.-W. Liu, C.-H. Cheng and T. -L. Wu, “A Compact Symmetrical Single-Cell Bidirectional Absorption Common-Mode Filter,” IEEE Trans. Compon. Packag. Manuf. Technol., 12(4), 655-664, Apr. 2022
  17. L. -C. Huang, C.-H. Cheng, S. Chen and T. -L. Wu, “A Novel Absorptive Power Delivery Network for Power Noise Mitigation,” IEEE Trans. Electromagn. Compat., 64(2), 536-542, Apr. 2022
  18. Y. -T. Chang, K.-Y. Ling and T. -L. Wu, “Wideband Reconfigurable Power Divider/Combiner in 40-nm CMOS for 5G mmW Beamforming System,” IEEE Trans. Microw. Theory Techn., 70(2), 1410-1422, Feb. 2022
  19. H. -W. Liu, C.-H. Cheng, P. -J. Li and T. -L. Wu, “A Novel Compact Single-Stage Absorption Common-Mode Filter,” IEEE Trans. Electromagn. Compat., 64(1), 111-118, Feb. 2022
  20. C. -Y. Liu, H. -E. Ding, S. -H. Wu and T. -L. Wu, “Extremely Low-Loss Planar Transition From Hollow Dielectric Waveguide to Printed Circuit Board for Millimeter-Wave Interconnect,” IEEE Trans. Microw. Theory Techn., 69, 4010-4020, Sept. 2021
  21. S. Chen and T. -L. Wu, “A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network,” IEEE Trans. Compon. Packag. Manuf. Technol., 11(9), 1514-1514, Sept. 2021
  22. C.-Y. Liu, H.-E. Ding, S.-H. Wu and T.-L. Wu, “Significant Crosstalk Reduction in High-Density Hollow Dielectric Waveguides by Photonic Crystal Fence,” IEEE Trans. Microw. Theory Techn., vol. 69, no. 2, 1316-1326, Feb. 2021
  23. C.-C. Chou and T.-L. Wu, “Poles and Stability of Full-Wave PEEC,” IEEE Trans. Antennas Propag., vol. 69, no. 2, 950-961, Feb. 2021
  24. P.-S. Wei, C.-N. Chiu, C.-C. Chou and T.-L. Wu, “Miniaturized Dual-Band FSS Suitable for Curved Surface Application,” IEEE Antennas Wireless Propag. Lett., vol. 19, no. 12, 2265-2269, Dec. 2020
  25. S. Chen and T.-L. Wu, “A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 10, no. 11, 1889-1901, Nov. 2020
  26. T.-Y. Lin and T.-L. Wu, “Balanced Bandpass Filter With Common-Mode Reflectionless Feature by Terminated Coupled Lines,” IEEE Trans. Electromagn. Compat., vol. 62, no. 4, 1090-1097, Aug. 2020
  27. P.-J. Li and T.-L. Wu, “A Novel Circuit Architecture of Bidirectional Common-Mode Noise Absorption Circuit,” IEEE Trans. Microw. Theory Techn., vol. 68, no. 4, 1476-1486, Apr. 2020
  28. C.-K. Chan and T.-L. Wu, “A High-Performance Common-Mode Noise Absorption Circuit Based on Phase Modification Technique,” IEEE Trans. Microw. Theory Techn., vol. 67, no. 11, 4394-4403, Nov. 2019
  29. P.-S. Wei, C.-N. Chiu, and T.-L. Wu, “Design and Analysis of an Ultraminiaturized Frequency Selective Surface With Two Arbitrary Stopbands,” IEEE Trans. Electromagn. Compat., vol. 61, no. 5, 1447-1456, Oct. 2019
  30. S. Chen, W.-C. Lee, and T.-L. Wu, “A Resistor-Free $N$ -Way Power Divider With Simultaneous Output Matching and Isolation,” IEEE Microw. Wireless Compon. Lett., vol. 29, no. 8, 523-525, Aug. 2019
  31. C.-C. Chou, S.-S. Weng, Y.-C. Lu, and T.-L. Wu, “EMI-Reduction Coding Based on 8b/10b,” IEEE Trans. Electromagn. Compat., vol. 61, no. 4, 1007-1014, Aug. 2019
  32. C.-K. Chan, C.-H. Cheng, and T.-L. Wu, “Design of a Broadband Common-Mode Filter With Four Transmission Zeros,” IEEE Trans. Electromagn. Compat., vol. 61, no. 4, 1052-1060, Aug. 2019
  33. C.-C. Chou and T.-L. Wu, “Direct Simulation of the Full-Wave Partial Element Equivalent Circuit Using Standard SPICE [Application Notes],” IEEE Microw. Mag., vol. 20, no. 6, 22-34, Jun. 2019
  34. Y.-C. Huang, C.-H. Cheng, and T.-L. Wu, “A Synthesized Method for Common-Mode Noise Suppression Filters With Specified Common-Mode and Differential Mode Response,” IEEE Trans. Electromagn. Compat., vol. 61, no. 3, 893-902, Jun. 2019
  35. C.-H. Cheng and T.-L. Wu, “Analysis and Design Method of a Novel Absorptive Common-Mode Filter,” IEEE Trans. Microw. Theory Techn., vol. 67, no. 5, 1826-1835, May 2019
  36. P.-J. Li and T.-L. Wu, “Synthesized Method of Dual-Band Common-Mode Noise Absorption Circuits,” IEEE Trans. Microw. Theory Techn., vol. 67, no. 4, 1392-1401, Apr. 2019
  37. T.-Y. Lin, Y.-C. Huang, and T.-L. Wu, “Novel Absorptive Balanced Bandpass Filters Using Resistive Loaded Transmission Lines,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 9, no. 4, 745-753, Apr. 2019
  38. C.-W. Lin, C.-K. Shen, C.-N. Chiu and T.-L. Wu, “Design and Modeling of a Compact Partially Transmissible Resistor-Free Absorptive Frequency Selective Surface for Wi-Fi Applications,” IEEE Trans. Antennas Propag., vol. 67, no. 2, 1306-1311, Feb. 2019
  39. S. Chen, W.-C. Lee and T.-L. Wu, “Balanced-to-Balanced and Balanced-to-Unbalanced Power Dividers With Ultra-Wideband Common-Mode Rejection and Absorption Based on Mode-Conversion Approach,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 9, no. 2, 306-316, Feb. 2019
  40. P.-S. Wei, M.-H. Tsai, S.-K. Hsu, C.-K. Shen and T.-L. Wu, “An Electromagnetic Bandgap Structure Integrated With RF LNA Using Integrated Fan-Out Wafer-Level Package for Gigahertz Noise Suppression,” IEEE Trans. Microw. Theory Techn., vol. 66, no. 12, 5484-5490, Dec. 2018
  41. P.-J. Li, C.-H. Cheng, and T.-L. Wu, “A Resistor-Free Absorptive Common-Mode Filter Using Gap-Coupled Resonator,” IEEE Microw. Wirel. Compon. Lett., vol. 28, no. 10, pp. 885-887, Oct. 2018
  42. C. Y. Lin, Y. C. Huang, and T. L. Wu, “Codesign of Electrostatic Discharge Protection Device and Common Mode Suppression Circuit on Printed Circuit Board,” IEEE Trans. Electromagn. Compat., vol. 60, no. 4, pp. 1095-1101, Aug. 2018
  43. H. L. Ting, S. K. Hsu and T. L. Wu, “Broadband Eight-Port Forward-Wave Directional Couplers and Four-Way Differential Phase Shifter,” IEEE Trans. Microw. Theory Techn., vol. 66, no. 5, pp. 2161-2169, May 2018
  44. C. W. Lin, C. K. Shen and T. L. Wu, “Ultracompact Via-Based Absorptive Frequency-Selective Surface for 5-GHz Wi-Fi With Passbands and High-Performance Stability,” IEEE Trans. Compon. Packag. Manuf. Techn., vol. 8, no. 1, pp. 41-49, Jan. 2018
  45. C.-C. Chou and T.-L. Wu, “Analysis of peak and statistical spectrum of random nonreturn-to-zero digital signals,” IEEE Trans. Electromag. Compat., vol. 59, no. 6, pp. 2002-2013, Dec. 2017
  46. C. K. Shen, Y. C. Lu, Y. P. Chiou, H. H. Hsieh, M. H. Tsai, S. Liu, and T. L. Wu, “EBG-Based Grid-Type PDN on Interposer for SSN Mitigation in Mixed-Signal System-in-Package,” IEEE Microw. Wirel. Compon. Lett., vol. 27, no. 12, pp. 1053-1055, Dec. 2017
  47. Y.-A. Hsu, C.-H. Cheng, Y.-C. Lu, and T.-L. Wu, “An accurate and fast substrate noise prediction method with octagonal TSV model for 3-D ICs,” IEEE Trans. Electromag. Compat., vol. 59, no. 5, pp. 1549-1557, Oct. 2017
  48. P.-J. Li, Y.-C. Tseng, C.-H. Cheng and T.-L. Wu, “A Novel Absorptive Common-Mode Filter for Cable Radiation Reduction,” IEEE Trans. Compon. Packag. Manuf. Techn., vol. 7, no. 4, pp. 511-518, Apr. 2017
  49. H.-L. Ting, S.-K. Hsu and T.-L. Wu, “A Novel and Compact Eight-Port Forward-Wave Directional Coupler With Arbitrary Coupling Level Design Using Four-Mode Control Technology,” IEEE Trans. Microw. Theory Techn, vol. 65, no. 2, pp. 467-475, Feb. 2017
  50. C. C. Chou, W. C. Lee and T. L. Wu, “A Rigorous Proof on the Radiation Resistance in Generalized PEEC Model,” IEEE Trans. Microw. Theory Techn., vol. 64, no. 12, pp. 4091-4097, Dec. 2016
  51. Y. J. Lin, Y. C. Tseng and T. L. Wu, “A Resonator-Based Suppressor for Mitigating the Noise Transfer on Metal Plates for Control of Electromagnetic Interference,” IEEE Trans. Microw. Compon. Lett., vol. 26, no. 11, pp. 906-908, Nov. 2016
  52. C.-K. Shen, S. Chen, and T.-L. Wu, “Compact Cascaded-Spiral-Patch EBG Structure for Broadband SSN Mitigation in WLAN Applications,” IEEE Trans. Microw. Theory Techn., vol. 64, no. 9, pp. 2740-2748, Sept. 2016
  53. C.-H. Cheng, and T.-L. Wu, “An Ultracompact TSV-Based Common-Mode Filter (TSV-CMF) in Three-Dimensional Integrated Circuits (3-D ICs),” IEEE Trans. Electromag. Compat., vol. 58, no. 4, pp. 1128-1135, Aug. 2016
  54. W.-J. Liao, R.-B. Wu, T.-L. Wu, T.-G. Ma, Y.-H. Pang, Z.-M. Tsai, H.-H. Yu, K.-M. Tu, H.-C. Lin, and S.-T. Peng, “Promoting Effective Education in Electromagnetics - Taiwan’s School of Accessible and Visualized Electromagnetics Formed,” IEEE Antennas Propag. Mag., pp. 99-129, Feb. 2016
  55. H.-C. Chen, S. Connor, M. S. Halligan, X. Tian, X. Li, B. Archambeault, J. L. Drewniak, and T.-L. Wu, “Investigation of the Radiated Emissions From High-Speed/High-Density Connectors,” IEEE Trans. Electromag. Compat., vol. 58, no. 1, pp. 220-230, Feb. 2016
  56. Y.-C. Tseng, H.-L. Ting, and T.-L. Wu, “A quadruplet-resonator based ferrite-free choke for suppressing noise currents on cable shielding,” IEEE Trans. Microw. Theory Techn., vol. 64, no. 1, pp. 86-95, Jan. 2016
  57. C.-C. Chou, S.-Y. Hsu, and T.-L. Wu,, “Estimation Method for Statistical Eye Diagram in a Nonlinear Digital Channel,” IEEE Trans. Electromag. Compat., vol. 57, no. 6, pp. 1655-1664, Dec. 2015
  58. C.-Y. Hsiao, Y.-C. Huang, and T.-L. Wu, “An Ultra-Compact Common-Mode Bandstop Filter With Modified-T Circuits in Integrated Passive Device (IPD Process,” IEEE Trans. Microw. Theory Techn., vol. 63, no. 11, pp. 3624-3631, Nov. 2015
  59. F.-C. Huang, C.-N. Chiu, T.-L. Wu, and Y.-P. Chiou, “A Circular-Ring Miniaturized-Element Metasurface with Many Good Features for Frequency Selective Shielding Applications,” IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 3, pp. 365-374, Jun. 2015
  60. C.-Y. Hsiao, C.-H. Cheng, and T.-L. Wu, “A New Broadband Common-Mode Noise Absorption Circuit for High-Speed Differential Digital Systems,” IEEE Trans. Microw. Theory Tech., vol.63, no.6, pp. 1894-1901, Jun. 2015
  61. C.-K. Shen, C.-H. Chen, D.-H. Han, and T.-L. Wu, “Modeling and Analysis of Bandwidth-Enhanced Multilayer 1-D EBG With Bandgap Aggregation for Power Noise Suppression,” IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 4, pp. 858-867, May 2015
  62. Y.-M. Yu, C.-N. Chiu, Y.-P. Chiou, T.-L. Wu, “An Effective Via-Based Frequency Adjustment and Minimization Methodology for Single-Layered Frequency Selective Surfaces,” IEEE Trans. Antennas Propag., vol.63, no.4, pp. 1641-1649, Jan. 2015
  63. F.-C. Huang, C.-N. Chiu, T.-L. Wu, and Y.-P. Chiou, “Very Closely Located Dual-band Frequency Selective Surfaces via Identical Resonant Elements,” IEEE Antennas and Wireless Propagation Letters, vol.14, pp. 414-417, Oct. 2014
  64. C.-Y. Hsiao and T.- L. Wu, “A novel dual-function circuit combining high-speed differential equalizer and common-mode filter with an additional zero,” IEEE Microw. Wireless Compon. Lett., vol. 24, no. 9, pp. 617-619, Sept. 2014
  65. T.-W. Weng, C.-H. Tsai, C.-H. Chen, D.-H. Han, and T.-L. Wu, “Synthesis Model and Design of a Common-Mode Bandstop Filter (CM-BSF) With an All-Pass Characteristic for High-Speed Differential Signals,” IEEE Trans. Microw. Theory Tech., vol.62, no.8, pp. 1647-1656, Aug. 2014
  66. Y.-M. Yu, C.-N. Chiu, Y.-P. Chiou, T.-L. Wu, “A Novel 2.5-Dimensional Ultraminiaturized-Element Frequency Selective Surface,” IEEE Trans. Antennas Propag., vol.62, no.7, pp. 3657-3663, Jul. 2014
  67. C.-H. Cheng, T.-Y. Cheng, C.-H. Du, Y.-C. Lu, Y.-P. Chiou, Sally Liu, T.-L. Wu, “An Equation-Based Circuit Model and its Generation Tool for 3-D IC Power Delivery Networks with an Emphasis on Coupling Effect,” IEEE Trans. Compon. Packag. Manuf. Technol., vol.4, no.6, pp. 1062-1070, Jun. 2014
  68. J.-H. Chou, J.-F. Chang, D.-B Lin, H.-J. Li, T.-L. Wu, “A Compact Loop-Slot Mode Combination Antenna for Ultra-thin Tablet Computer with Metallic Bottom Cover,” IEEE Antennas Wireless Propag. Lett., vol. 13, pp. 746-749, Apr. 2014
  69. H.-H. Chuang, G.-H. Li, E. Song, H.-H. Park, H.-T. Jang, H.-B. Park, Y.-J. Zhang, D. Pommerenke, T.-L. Wu, and J. Fan, “A magnetic-field resonant probe with enhanced sensitivity for RF interference applications,” IEEE Trans. Electromag. Compat., vol. 55, no. 6, pp. 991-998, Dec. 2013
  70. T.-H. Lin, S.-K. Hsu, and T.-L. Wu, “Bandwidth enhancement of 4 x 4 butler matrix using broadband forward-wave directional coupler and phase difference compensation,” IEEE Trans. Microw. Theory Tech., vol. 61, no. 12, pp. 4099-4109, Dec. 2013
  71. C.-D. Wang, Y.-J. Chang, Y.-C. Lu, P.-S. Chen, W.-C. Lo, Y.-P. Chiou, and T.-L. Wu, “ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 10, pp. 1744-1753, Oct. 2013
  72. Y.-J. Cheng, H.-H. Chuang, C.-K. Cheng, and T.-L. Wu, “Novel differential-mode equalizer with broadband common-mode filtering for Gb/s differential-signal transmission,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 9, pp. 1578-1587, Sept. 2013
  73. T.-L. Wu, F. Buesink, and F. Canavero, “Overview of signal integrity and EMC design technologies on PCB:fundamentals and latest progress,” IEEE Trans. Electromag. Compat., vol. 55, no. 4, pp. 624-638, Aug. 2013
  74. C.-D. Wang and T.-L. Wu, “Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression,” IEEE Trans. Electromag. Compat., vol. 55, no. 1, pp. 159-167, Feb. 2013
  75. C.-H. Huang and T.-L. Wu, “Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 1, pp. 21-30, Jan. 2013
  76. J.-C. Yen, S.-K. Hsu, T.-H. Lin, and T.-L. Wu, “A Broadband Forward-Wave Directional Coupler Using Periodic Y-Shaped Ground Via Structures With Arbitrary Coupling Levels,” IEEE Trans. Microw. Theory Tech., vol.61, no.1, pp. 38-47, Jan. 2013
  77. C.-Y. Hsiao, C.-H. Tsai, C.-N. Chiu, T.-L. Wu, “Radiation suppression for cable-attached packages utilizing a compact embedded common-mode filter,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 2, no. 10, pp. 1696-1703, Oct. 2012
  78. H.-H. Chuang, C.-C. Chou, Y.-J. Chang, and T.-Z. Wu, “A branched reflector technique to reduce crosstalk between slot-crossing differential line,” IEEE Microw. Wireless Compon. Lett., vol. 22, no. 7, pp. 342-344, Jul. 2012
  79. T.-Y. Cheng, C.-D. Wang, Y.-P. Chiou, and T.-L. Wu, “A new macro-π model for through-silicon vias on 3-D IC using conformal mapping method,” IEEE Microw. Wireless Compon. Lett., vol. 22, no. 6, pp. 303 - 305, Jun. 2012
  80. H.-C. Chen, C.-H. Tsai, and T.-L. Wu, “A compact and embedded balanced bandpass filter with wideband common-mode suppression on wireless SiP,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 2, no. 6, pp. 1030-1038, Jun. 2012
  81. C.-D. Wang, Y.-M. Yu, F. d. Paulis, A. C. Scogna, A. Orlandi, Y.-P. Chiou, and T.-L. Wu, “Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 2, no. 2, pp. 332-341, Feb. 2012
  82. C.-H. Tsai, I.-I. A. Ieong, H.-C. Chen, and T.-L. Wu, “A miniaturized and broadband balun using artificial couopled line with imaginary even-mode impedance,” IEEE Trans. Microw. Theory Tech., vol. 59, no. 9, pp. 2233-2240, Sept. 2011
  83. H.-H. Chuang and T.-L. Wu, “Suppression of common-mode radiation and mode-conversion for slot-crossing GHz differential signals using novel grounded resonators,” IEEE Trans. Electromagn. Compat., vol. 53, no. 2, pp. 429-436, May 2011
  84. S.-K. Hsu, J.-C. Yen, and T.-L. Wu, “A novel compact forward-wave directional coupler design using periodical patterned ground structure,” IEEE Trans. Microw. Theory Tech., vol. 59, no 5, pp. 1249-1257, May 2011
  85. H. H. Chuang and T. L. Wu, “A novel ground resonator technique to reduce common-mode radiation on slot-crossing differential signals,” IEEE Microw. Wireless Compon. Lett., vol. 20, no. 12, pp. 660 - 662, Dec. 2010
  86. C.-H. Cheng, C.-H. Tsai, and T.-L. Wu, “A novel time domain method to extract equivalent circuit model of patterned ground structures,” IEEE Microw. Wireless Compon. Lett., vol. 20, no. 9, pp. 486-488, Oct. 2010
  87. C.-Y. Hsieh, C.-D. Wang, K.-Y. Lin, and T.-L. Wu, “A power bus with multiple via ground surface perturbation lattices for broadband noise isolation: modeling and application in RF-SiP,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 582-591, Aug. 2010
  88. S.-K. Hsu, C.-H. Tsai, and T.-L. Wu, “A novel miniaturized forward-wave directional coupler with periodical mushroom-shaped ground plane,” IEEE Trans. Microw. Theory Tech., vol. 58, no. 8, pp. 2277-2283, Aug. 2010
  89. T.-L. Wu, J. Fan, F. d. Paulis, C.-D. Wang, A. C. Scogna, and A. Orlandi, “Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology,” IEICE Trans. Commun. (Invited paper), vol .E93-B, no. 07, Jul. 2010
  90. A. Ciccomancini, T. L. Wu, and A. Orlandi, “Noise coupling mitigation in PWR/GND plane pair by means of photonic crystal fence: sensitivity analysis and design parameters extraction,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 574-581, May 2010
  91. W.-Y. Huang, T.-K. Wang, and T.-L. Wu, “Design and modelling of miniaturized bandgap structure for wideband GHz-noise suppression based on LTCC technology,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 630-638, May 2010
  92. T.-L. Wu, H.-H. Chuang, and T.-K. Wang, “Overview of power integrity solutions on package and PCB: decoupling and EBG isolation,” IEEE Trans. Electromagn. Compat. (Invited paper), vol. 52, no. 2, pp. 346-356, May 2010
  93. H.-H. Chuang, W.-D. Guo, Y.-H. Lin, H.-S. Chen, Y-C Lu, J. Hong, C.-H. Yu, A. Cheng, J. Chou, C.-J. Chang, J. Ku, T.-L. Wu, and R.-B. Wu, “Signal/Power integrity modeling of high-speed memory modules using chip-package-board co-analysis,” IEEE Trans. Electronmagn. Compat., vol. 52, no. 2, pp. 381-391, May 2010
  94. H.-H. Chuang, C.-J. Hsu, J. Hong, C.-H. Yu, A. Cheng, J. Ku, and T.-L. Wu, “A broadband chip-level power-bus model feasible for power integrity chip-package co-design in high-speed memory circuits,” IEEE Trans. Electromagn. Compat., vol. 52, no. 1, pp. 235-239, Feb. 2010
  95. G.-Z. Wu, Y.-C. Chen, and T.-L. Wu, “Design and implementation of a novel hybrid photonic crystal power/ground layer for broadband power noise suppression,” IEEE Trans. Adv. Packag., vol. 33, no. 1, pp. 206-211, Feb. 2010
  96. C.-H. Tsai and T.-L. Wu, “A broadband and miniaturized common-mode filter for gigahertz differential signals based on negative permittivity metamaterials,” IEEE Trans. Microw. Theory Tech., vol. 58, no. 1, pp. 195-202, Jan. 2010
  97. T.-K. Wang, C.-Y. Hsieh, H.-H. Chuang, and T. L. Wu, “Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression,” IEEE Trans. Microw. Theory Tech., vol. 57, no. 8, pp. 2047-2054, Aug. 2009
  98. S.-J. Wu, C.-H, Tsai, T.-L. Wu, and T.-Itoh, “A novel wideband common-mode suppression filter for GHz differential signals using coupled patterned ground structure,” IEEE Trans. Microw. Theory Tech., vol. 57, no.4, pp. 848-855, Apr. 2009
  99. T.-K. Wang, T.-W. Han, and T.-L. Wu, “A novel power/ground layer using artificial substrate EBG for simultaneously switching noise suppression,” IEEE Trans. Microw. Theory Tech., vol. 56, no. 5, pp. 1164-1171, May 2008
  100. W.-T. Liu, C.-H. Tsai, T.-W. Han, and T.-L. Wu, “An embedded common-mode suppression filter for GHz differential signals using periodic defected ground plane,” IEEE Microw. Wireless Compon. Lett., vol. 18, no. 4, pp. 248-250, Apr. 2008
  101. P.-J. Cheng, T.-L. Wu, S.-W. Shaw, H.-Y. Chueh, C.-T. Lin, J.-J. Hsu, T.-T. Hsieh, and Y.-K. Soong, “Anxiety levels in women undergoing prenatal maternal serum screening for down syndrome: the effect of a fast reporting system by mobile phone short-message service,” Prenat. Diagn., vol. 28, pp. 417-421, Apr. 2008
  102. T.-K. Wang, S.-T. Chen, C.-W. Tsai, S.-M. Wu, J. J. Drewniak, and T.-L. Wu, “Modeling noise coupling between package and PCB power/ground planes with an efficient 2D-FDTD/lumped element method,” IEEE Trans. Adv. Packag., vol. 30, no. 4, pp. 864-871, Nov. 2007
  103. C.-H. Chao, S. L. Chuang, and T.-L. Wu, “Theoretical demonstration of enhancement of light extraction of flip-chip GaN light-emitting diodes with photonic crystals,” Appl. Phy. Lett., vol. 89, pp. 091116, Dec. 2006
  104. C.-C. Wang, C.-W. Ku, C.-C. Kuo, and T.-L. Wu, “A time-domain approach for extracting broadband macro-π models of differential via holes,” IEEE Trans. Adv. Packag., vol. 29, no. 4, pp. 789-797, Nov. 2006
  105. C.-M. Chang, J.-C. Chiu, W.-S. Jou, T.-L. Wu, W.-H. Cheng, “New package scheme of a 2.5Gb/s plastic tranceiver module employing mutiwall nanotubes for low electromagnetic interference,” IEEE J. Select. Top. Quantum Electron., vol. 12, no. 5, pp. 1025-1031, Oct. 2006
  106. T.-L. Wu and S.-T. Chen, “A photonic crystal power/ground layer for eliminating simultaneously switching noise in high-speed circuit,” IEEE Trans. Microw. Theory Tech., vol. 54, no. 8, pp. 3398-3406, Sept. 2006
  107. T.-L. Wu, M.-C. Lin, C.-W. Lin, W.-S. Jou, T.-T. Shih, and W.-H. Cheng, “A high electromagnetic immunity plastic composite package for a 10-gb/s optical transceiver module,” IEEE/OSA J. Lightw. Technol., vol. 24, no. 8, pp. 3195-3201, Aug. 2006
  108. T.-L. Wu and S.-T. Chen, “An electromagnetic crystal power substrate with efficient suppression of power/ground plane noise on high-speed circuits,” IEEE Microw. Wireless Compon. Lett., vol. 16, no. 7, pp. 413-415, Jun. 2006
  109. J.-S. Chiang and T.-L. Wu, “Analysis of propagation characteristics for an octagonal photonic crystal fiber (O-PCF),” Opt. Commun. (SCI), vol. 258, pp. 170-176, Feb. 2006
  110. T. L. Wu and T. K. Wang, “Embedded power plane with ultra-wide stop-band for simultaneously switching noise on high-speed circuits,” Electron. Lett., vol. 42, no. 4, pp. 213-214, Feb. 2006
  111. T.-L. Wu, Y.-H. Lin, T.-K. Wang, C.-C. Wang, and S.-T. Chen, “Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits,” IEEE Trans. Microw. Theory Tech. (SCI, NSC 93-2213-E-110-010), vol. 53, no. 9, pp. 2935-2942, Sept. 2005
  112. T.-L. Wu and C.-H. Chao, “An efficient approach for calculating the dispersions of photonic crystal fibers: design of the nearly zero ultra-flattened dispersion,” IEEE/OSA J. Lightw. Technol. (SCI), vol. 23, no. 6, pp. 2055-2061, Jun. 2005
  113. T.-L. Wu , C.-C. Wang, C.-C. Kuo, and J.-S. Hsieh, “A novel time-domain method for synthesizing broadband macro-PI models of differential via,” IEEE Microw. Wireless Compon. Lett. (SCI), vol. 15, no. 5, pp. 378-380, May 2005
  114. T.-L. Wu, M.-C. Lin, C.-H. Lee, T.-T. Shih, and W.-H. Cheng, “High electromagnetic susceptibility (EMS) plastic package for 10Gbps optical transceiver module,” Electron. Lett. (SCI), vol. 41, no. 8, pp. 494-495, Apr. 2005
  115. T.-L. Wu, Y.-H. Lin and T.-K. Wang, “A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits,” IEEE Microw. Wireless Compon. Lett. (SCI), vol. 15, no. 3, pp. 174-176, Mar. 2005
  116. T.-L. Wu, C.-W. Lin, W.-C. Hung, C.-H. Lee, W.-S. Jou, and W.-H. Cheng, “High electromagnetic shielding of plastic package for 2.5Gbps optical transceiver modules,” IEEE Trans. Adv. Packag., vol. 28, no. 1, pp. 89-95, Feb. 2005
  117. T.-L. Wu and C.-H. Chao, “A novel ultra-flattened dispersion photonic crystal fiber,” IEEE Photon. Technol. Lett. (SCI), vol. 17, no. 1, pp. 67-69, Jan. 2005
  118. W.-H. Cheng, W.-C.Hung, C.-H. Lee, G.-L. Hwang, W.-S. Jou, and T.-L. Wu, “Low cost and low electromagnetic interference packaging of optical transceiver modules,” IEEE/OSA J. Lightw. Technol. (SCI), vol. 22, no. 9, pp. 2177-2183, Sept. 2004
  119. T.-L. Wu, Y.-H. Lin, and S.-T. Chen, “A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures,” IEEE Microw. Wireless Compon. Lett. (SCI), vol. 14, no. 7, pp. 337-339, Jul. 2004
  120. T.-L. Wu, J.-S. Chiang, and C.-H. Chao, “A novel approach for calculating the dispersions of photonic crystal fibers,” IEEE Photon. Technol. Lett. (SCI), vol. 16, no. 6, pp. 1492-1494, Jun. 2004
  121. T.-L. Wu, W.-S. Jou, W.-C. Hung, C.-H. Lee, C.-W. Lin, and W.-H. Cheng, “A high shielding effectiveness plastic package for 2.5Gbps optical transceiver module,” Electron. Lett. (SCI), vol. 4, no. 4, pp. 260- 262, Feb. 2004
  122. T.-L. Wu, Y.-S. Huang, and S.-T. Chen, “A novel approach for the incorporation of arbitrary linear lumped network into FDTD method,” IEEE Microw. Wireless Compon. Lett. (SCI, NSC91-2213-E-110-034), vol. 14, no. 2, pp. 74-76, Feb. 2004
  123. T.-L. Wu, C.-C. Kuo, C.-C. Wang, S.-M. Wu, and C.-P. Hung, “A novel time-domain algorithm for synthesizing broadband macromodels of coupled interconnects,” IEEE Trans. on Adv. Packag. (SCI), vol. 27, no. 1, pp. 224-232, Feb. 2004
  124. T.-L. Wu, S.-T. Chen, J.-N. Huang, and Y.-H. Lin, “Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB,” IEEE Trans. Electromagn. Compat. (SCI, NSC91-2213-E-110-034), vol. 46, no. 1, pp. 33-45, Feb. 2004
  125. T.-L. Wu and H.-J. Ou, “Rigorous analysis of polarization dependence loss (PDL) for equilateral 3x3 fused fiber couplers,” IEEE Photon. Technol. Lett. (SCI, NSC92-2215-E-110-005), vol. 16, no. 1, pp. 165-167, Jan. 2004
  126. T.-L. Wu and C.-H. Chao, “Photonic crystal fiber analysis through the vector boundary-element method: effect of elliptical air hole,” IEEE Photon. Technol. Lett. (SCI, NSC91-2215-E-110-018), vol. 16, no. 1, pp. 126-128, Jan. 2004
  127. T.-L. Wu and C.-H. Chao, “3D electromagnetic modeling of polarization-dependent coupling characteristics of 1x3 linear array weakly fused fiber couplers,” Fiber Integr. Opt. (SCI, NSC91-2215-E-110-018), vol. 22, no. 6, pp. 415-432, Nov. 2003
  128. T.-L. Wu and H.-J. Ou, “A vector power coupling model for analyzing polarization dependent loss (PDL) of equilateral triangular 3x3 weakly fused fiber couplers,” Opt. Commun. (SCI, NSC 91-2215-E-110-018), vol. 224, pp. 81-88, Aug. 2003
  129. T.-L. Wu, C.-C. Kuo , H.-C. Chang, and J.-S. Shie, “A novel systematic approach for equivalent model extraction of embedded high-speed interconnects in time domain,” IEEE Trans. Electromagn. Comapt. (SCI, NSC91-2213-E-110-034), vol. 45, no. 3, pp. 493-501, Aug. 2003
  130. T.-L. Wu, W.-S. Jou, S.-G. Dai, and W.-H. Cheng, “Effective electromagnetic shielding of plastic packaging in low-cost optical transceiver modules,” IEEE/OSA J. Lightw. Technol. (SCI, NSC90-2215-E-110-029), vol. 21, no. 6, pp. 1536-1543, Jun. 2003
  131. W.-S. Jou, T.-L. Wu, S.-K. Chiu, and W.-H. Cheng, “The influence of fiber orientation on electromagnetic shielding in liquid crystal polymers,” IEEE/TMS J. Electron. Mater. (SCI), vol. 31, no. 3, pp. 178-184, Mar. 2002
  132. T.-L. Wu, Y.-H. Lin, J.-N. Huang, and J.-J. Lin, “The effect of test system impedance on measurements of ground bounce in printed circuit boards,” IEEE Trans. Electromagn. Compat. (SCI, NSC89-2215-E-110-004), vol. 43, no. 4, pp. 600-607, Nov. 2001
  133. W.-S. Jou, T.-L. Wu, S.-K. Chiu, and W.-H. Cheng, “Electromagnetic shielding of nylon-66 composites applied to laser modules,” IEEE/TMS J. Electron. Mater. (SCI), vol. 30, no. 10, pp. 1287-1293, 2001
  134. T.-L. Wu, “Three dimensional dlectromagnetic modeling of fiber-core effect on the coupling characteristics of weakly fused couplers,” IEEE/OSA J. Lightw. Technol. (SCI, NSC88-2218-E-110-009), vol. 18, no. 7, pp. 1024-1030, Jul. 2000
  135. W.-H. Cheng, J.-Y. Cheng, T.-L. Wu, C.-M. Wang, S.-C. Wang, and W.-S. Jou, “Electromagnetic shielding of plastic packaging in low-cost laser modules,” Electron. Lett. (SCI, NSC88-2215-E-110-007), vol. 36, no. 2, pp. 118-119, Jan. 2000
  136. C.-S. Hsieh, T.-L. Wu, and W.-H. Cheng, “An optimum approach for fabrication of low loss fused fiber couplers,” Mater. Chemistry Phy. (SCI), pp. 846-851, Jan. 2000
  137. T.-L. Wu, “Vectorial analysis for polarization effect of wavelength-flattened fiber-optic couplers,” Microw. Opt. Technol. Lett. (SCI), vol. 23, no. 1, Oct. 1999
  138. S.-W. Yang, T.-L. Wu, C.-W. Wu, and H.-C. Chang, “Numerical modeling of weakly fused fiber-optic polarization beamsplitter - part II: the three-dimensional electromagnetic model,” IEEE/OSA J. Lightw. Technol. (SCI), vol. 16, no. 4, pp. 691-697, Apr. 1998
  139. T.-L. Wu, “Vectorial analysis of fiber-core effects in weakly fused couplers,” IEEE Photon. Technol. Lett. (SCI), vol. 9, no. 2, pp. 218-219, Feb. 1997
  140. C.-W. Wu, S.-T. Lu, T.-L. Wu, and H.-C. Chang, “All-fiber brewster windows made with extremely weakly fused asymmetrical coupler,” IEEE Photon. Technol. Lett. (SCI), vol. 7, no. 9, pp. 1054-1056, Sept. 1995
  141. T.-L. Wu and H.-C. Chang, “An efficient numerical approach for determining the dispersion characteristics of dual-mode elliptical-core optical fibers,” IEEE/OSA J. Lightw. Technol. (SCI), vol. 13, no. 9, pp. 1926-1934, Sept. 1995
  142. H.-C. Chang, T.-H. Lin, and T.-L. Wu,, “Accurate coupling coefficients for fiber couplers with weakly-fused cross sections,” Appl. Opt. (SCI), vol. 34, no. 27, pp. 6168-6171, Sept. 1995
  143. C.-W. Wu, T.-L. Wu, and H.-C. Chang, “A novel fabrication method for all-fiber weakly fused polarization beamsplitters,” IEEE Photon. Technol. Lett. (SCI), vol. 7, no. 7, pp. 786-788, Jun. 1995
  144. T.-L. Wu and H.-C. Chang, “Rigorous analysis of form birefringence of weakly fused fiber-optic couplers,” IEEE/OSA J. Lightw. Technol. (SCI), vol. 13, no. 4, pp. 687-691, Apr. 1995
  145. T.-L. Wu and H.-C. Chang, “Rigorous analysis of form birefrigence of fused fiber couplers,” Electron. Lett. (SCI), vol. 30, no. 12, pp. 998-999, Jul. 1994

Conference & proceeding papers:

  1. Y.-T. Chen, Y.-Y. Cheng, and T.-L. Wu, “Optimization of TSV Array Based on Mathematical Model for HBM3,” 2024 IEEE 33nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Toronto, Canada, Oct. 2024
  2. Y.-T. Chen, Y.-Y. Cheng, and T.-L. Wu, “ Optimization of TSV Array Based on Mathematical Model for HBM3,” 2024 IEEE 33nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2024
  3. L. -Y. Wu, C. -Y. Fang, B. -C. Tseng, Jackson Y. and T. -L. Wu, “Comparison of Radio Frequency Interference (RFI) Issue between Differential and Common Modes in USB Channel,” 2024 International Symposium on Electromagnetic Compatibility (EMC Europe), Sept. 2024
  4. Y. -Y. Cheng, S. -K. Yang, S. -H. Wu and T. -L. Wu, “The Worst-Case Eye Prediction Algorithm for MIPI C-PHY Signaling on Mobile Artificial Intelligence (AI) Chips,” 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Aug. 2024
  5. Y.-R. Chen, Y.-T. Lin and T.-L. Wu, “Comparisons of Equalization Performances and CM Suppression on NRZ and PAM4 Signals using Wideband DME-CMF,” 2024 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Okinawa, Japan, May 2024
  6. P.-S. Su, L.-C. Huang, L.-C. Wan, P.-H. Tsou and T.-L. Wu, “Accuracy Improvement in Calibration Method for Complex Material Characterization by Coaxial Holder,” 2023 Asia-Pacific Microwave Conference (APMC), 647-649, Taipei, Taiwan, Dec. 2023
  7. J.-G. Chen, Y.-T. Lin, C.-C. Chou and T.-L. Wu, “Wideband Mutual Coupling Reduction in mm-wave Aperture-coupled Stacked Patch Antenna Arrays using a Novel Mushroom-like Resonator,” 2023 XXXVth URSI General Assembly and Scientific Symposium (URSI GASS), Sapporo, Japan, Aug. 2023
  8. L.-H. Huang, Y.-Y. Cheng, T.-L. Wu, “HBM3 PPA Performance Evaluation by TSV Model with Micro-Bump and Hybrid Bonding,” 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 1-3, Milpitas, CA, USA, 2023
  9. H.-W. Liu, and T.-L. Wu, “A Wideband Single-Cell Unidirectional Absorption Common-Mode Filter with Pattern Ground Structure,” 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 13-15, Beijing, China, May 2022
  10. Y.-T. Lin, H.-C. Kuo, P.-I Wu, M.-F. Jhong, P.-C. Pan, C.-Y. Liu, C.-C. Wang and T.-L. Wu, “A planar High-efficient W-band Substrate-Integrated-Waveguide Cavity-backed Slot Antenna Array,” 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 93-97, San Diego, USA, May 2022
  11. Y.-C. Chien, H-W. Liu and T.-L. Wu, “An Ultrawideband Common-Mode Filter with Cascaded Mushroom-like Structures,” 2021 IEEE International Symposium on Radio-Frequency Integration Technology(RFIT), Hualien, Taiwan, Aug. 2021
  12. Y.-T. Lin, H.-C. Kuo, P.-I Wu, M.-F. Jhong, P.-C. Pan, C.-Y. Liu, C.-C. Wang and T.-L. Wu, “Extraction of Complex Permittivity of Dielectrics on Package from W-Band to D-Band,” 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, USA, 2021
  13. P.-Y. Weng, C.-C. Chou and T.-L. Wu, “EMI Reduction Control Based on 8b/10b,” 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 609-613, Reno, NV, USA, 2020
  14. C.-K. Chan et al., “Power Distribution Network Modeling and Design of Re-Distribution Layer in DDR Application,” 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI), 1-4, Cologne, Germany, 2020
  15. C.-W. Ting, S. Chen and T.-L. Wu, “A Cost-efficient Air-Filled Substrate Integrated Ridge Waveguide for mmWave Application,” 2020 IEEE/MTT-S International Microwave Symposium (IMS), 165-168, Los Angeles, CA, USA, 2020
  16. R.-J. Liu, C.-C. Chou and T.-L. Wu, “An Improved Method of Finding Complex Permittivity of Lossy Liquids,” 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, Shenzhen, China, 2020
  17. P.-Y. Weng et al., “Enhanced Power and Signal Integrity Through Layout Optimization of High-Speed Memory Systems,” 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, KAOHSIUNG, Taiwan, Dec. 2019
  18. C.-W. Ting, K.-C. Chen, S. Chen and T.-L. Wu, “A mm-Wave Low-Loss Transition from Microstrip Line to Air-Filled Substrate Integrated Wavguide on Printed Circuit Board Technology,” 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, KAOHSIUNG, Taiwan, Dec. 2019
  19. H.-W. Liu, C.-H. Cheng, and T.-L. Wu, “Miniaturized Quarter-Wavelength Resonator for Common-Mode Filter Based on Pattern Ground Structure,” 2019 EMC Sapporo/APEMC, 816-819, Sapporo, Japan, 2019
  20. P.-J. Li, C.-C. Chou, and T.-L. Wu, “Modeling of Radiated Emission caused by Coaxial-to-microstrip Transition,” 2019 International Conference on Electromagnetics in Advanced Applications (ICEAA), 0245-0249, Granada, Spain, 2019
  21. P.-Y. Weng et al., “Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems,” 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 1-3, Montreal, QC, Canada, 2019
  22. C.-H. Cheng and T.-L. Wu, “A Common-Mode Filter with Three Alterable and Designable Transmission Zeroes,” International Symposium on Electromagnetic Compatibility (EMC EUROPE), pp. 429-432, Amsterdam, Netherlands, Aug. 2018
  23. C.-Y. Lin and T.-L. Wu, “Investigation on Degradation of Common Mode Noise Suppression with Electrostatic Discharge Protection Array,” International Symposium on Electromagnetic Compatibility (EMC EUROPE), pp. 463-466, Amsterdam, Netherlands, Aug. 2018
  24. M.-H. Tsai, S.-K. Hsu, C.-K. Shen, P.-S. Wei, C.-H. Chern and T.-L. Wu, “A Miniature Electromagnetic Bandgap Structure Using Integrated Fan-Out Wafer-Level Package (InFO-WLP) for Gigahertz Noise Suppression,” IEEE/MTT-S International Microwave Symposium - IMS, pp. 1542-1544, Philadelphia, PA, Jun. 2018
  25. P. J. Li and T. L. Wu, “An eye diagram improvement method using simulation annealing algorithm,” IEEE 22nd Workshop on Signal and Power Integrity (SPI), Brest, France, May 2018
  26. Y. T. Lin, C. H. Cheng, and T. L. Wu, “Fast and accurate yield rate prediction of PCB embedded common-mode filter with artificial neural network,” IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibil, pp. 542-545, Singapore, May 2018
  27. L. H. Yen et al., “Modularized prototype of 5G mmWave base station system at 38 GHz,” IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibil, pp. 396-398, Singapore, May 2018
  28. C.-K, Chan, T.-M. Wu, M.-L. Wu, G.-J. Fan, C. Shiah, C.-C. Lu, and T.-L. Wu, “Signal/Power Integrity Co-Simulation of DDR3 Memory Module,” IEEE International Conference on Computational Electromagnetics (ICCEM), Chengdu, Mar. 2018
  29. P.-Y. Weng, C.-H. Chen, C.-H. Chen, C.-L. Liao, T.-L. Wu, and B. Mutnury, “Factors Affecting Near-End Crosstalk (NEXT) in High Speed Serial Links,” 2018 15th International Conference on ElectroMagnetic Interference & Compatibility (INCEMIC), 1-4, India, 2018
  30. S. Chen and T.-L. Wu, “A Power Divider with Controllable Transmission Zeros Using Lumped Artificial Transmission Line,” 2018 Asia-Pacific Microwave Conference (APMC), 1097-1099, Kyoto, 2018
  31. T.-Y. Lin and T.-L. Wu, “Compact Quasi-Elliptic Bandpass Filter Using Magnetically Coupled LC Resonator Pair,” 2018 Asia-Pacific Microwave Conference (APMC), 1354-1356, Kyoto, 2018
  32. S. Chen, C. Chen, C. L. Liao, J. Chen, T. L. Wu and B. Mutnury, “Via optimization for next generation speeds,” IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, Oct. 2017
  33. P. J. Li and T. L. Wu, “A super broadband DGS-based common-mode filter with a compact dimension,” IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, Oct. 2017
  34. Y. C. Huang, C. Y. Lin and T. L. Wu, “A simple method to improve signal integrity of electrostatic discharge protection devices,” IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, Oct. 2017
  35. C. H. Cheng and T. L. Wu, “A modal-analysis-based prediction method for radiation power in differential channels with discontinuity,” International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France, Sept. 2017
  36. C.-Y. Lin and T.-L. Wu, “Electrostatic discharge protection device and common mode suppression circuit on printed circuit board codesign,” IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), pp. 772-775, Washington, DC, Aug. 2017
  37. C.-C. Chou and T.-L. Wu, “EMI-reduction coding based on 8b/10b,” IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), pp. 373-376, Washington, DC, Aug. 2017
  38. C. K. Shen, T. L. Wu, T. M. Shen, C. Y. Hsiao, T. K. Wang and K. Y. Chen, “An efficient partition analysis for electromagnetic interference estimation of high-speed input/output differential interfaces,” IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), pp. 195-197, Seoul, South Korea, May 2017
  39. Z.-M. Tsai, R.-B. Wu, T.-L. Wu, S.-Y. Chen, S.-G. Mao and T.-G. Ma, “The competitions of electromagnetic for undergraduate students in Taiwan: Taiwan creative electromagnetic implementation competition T-CEIC,” IEEE International Conference on Computational Electromagnetics (ICCEM), pp. 86-88, Kumamoto, Japan, Mar. 2017
  40. T.-Y. Lin and T.-L. Wu, “Balanced Bandpass Filter With Reflectionless common-mode Suppression,” IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), pp. 17-19, Honolulu, HI, Dec. 2016
  41. C.-W. Lin, C.-K. Shen and T.-L. Wu, “Design and Modeling of an Absorptive Frequency Selective Surface with Several Transmissive Bands,” IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), pp. 33-35, Honolulu, HI, Dec. 2016
  42. C.-Y. Lin and T.-L. Wu, “E shape resonator dualband common mode filter,” IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS), pp. 21-24, San Diego, CA, Oct. 2016
  43. C.-Y. Liu, C.-K. Shen, S.-Y. Chen, T.-L. Wu, J.-J. Chang, B.-C. Tseng, and J. Yen, “Study of Frequency Offset Behavior for Artificial Magnetic Structure in Compact Mobile Device,” IEEE International Symposium on Antennas and Propagation (APSURSI), pp. 1915-1916, Fajardo, Puerto Rico, Jun. 2016
  44. S. Chen, W.-C. Lee, and T.-L. Wu, “A Balanced-to-Balanced Power Divider with Common-Mode Noise Absorption,” IEEE MTT-S International Microwave Symposium (IMS), San Francisco, CA, May 2016
  45. Y.-A. Hsu, C.-C. Chou, C.-H. Cheng, and T.-L. Wu, “A Radiation Prediction Method based on Partial Element Equivalent Circuit,” IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), pp. 706-708, Shenzhen, May 2016
  46. P.-J. Li, C.-H. Cheng, Y.-C. Tseng, and T.-L. Wu, “Novel Absorptive Design of Common-Mode Filter at Desired Frequency Band,” IEEE 20th Workshop on Signal and Power Integrity (SPI), Turin, Italy, May 2016
  47. P.-J. Li, Y.-C. Tseng and T.-L. Wu, “Radiation mechanism and solution of cable attached differential signals,” IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), pp. 430-432, Shenzhen, May 2016
  48. W.-Y. Hsu, C.-K. Shen, T.-L. Wu, Ch.-H. Chen, and D.-H. Han, “Post-fabricated EBG Tape on Electronic Devices for RFI Mitigation in WLAN Bands,” IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, Seoul, South Korea, Dec. 2015
  49. C. H. Chen, Y. C. Tseng , I C. Lin , C. C. Fu, K. H. Liao and T. L. Wu, “Prediction of near-field shielding effectiveness for conformal-shielded SiP and measurement with magnetic probe,” IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 77-79, San Jose, CA, USA, Oct. 2015
  50. Y. A. Hsu, C. H. Cheng, Y. C. Lu and T. L. Wu, “A Prediction Method of Heat Generation in the Silicon Substrate for 3-D ICs,” IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 89-92, San Jose, CA, USA, Oct. 2015
  51. C.-K. Shen, and T.-L. Wu, “Compact Hybrid Open Stub EBG Structure for Power Noise Suppression in WLAN Band,” in Proc. Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe, Dresden, Germany, Aug. 2015
  52. Y.-M. Yu, C.-N. Chiu, Y.-P. Chiou, and T.-L. Wu, “Suppression of End-fired Emission for a Miniaturized-Element Frequency-Selective Shielding Surface with Finite Size Using EBG,” in Proc. IEEE. Int. Symp. Electromagn. Compat., Dresden, Germany, Aug. 2015
  53. Y.-C. Tseng, P.-Y. Weng, and T.-L. Wu, “Compact Wideband Balanced Filter for Eliminating Radio-Frequency Interference on Differentially-fed Antennas,” in Proc. Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe, Dresden, Germany, Aug. 2015
  54. C.-H. Cheng, and T.-L. Wu, “Effective Current Distribution Analysis Method for Multiconductor-Transmission-Line (MTL) System with Arbirary Conductor Number Variation,” in Proc. Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe, Dresden, Germany, Aug. 2015
  55. Y.-M. Yu and T.-L. Wu, “A Via-Based Methodology for Frequency Selective Surface Minimization,” in Proc. IEEE Int. Symp. Antennas Propag., Vancouver , Canada, Jul. 2015
  56. C.-K. Shen, M.-H. Tsai, H.-N. Chen, C.-P. Jou, Sally Liu, F.-L. Hsueh, and T.-L. Wu, “Design of On-Chip Microwave Filters in Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology,” in Proc. Asia-Pacific Int. Symp. Electronmagn. Compat., Taipei, Taiwan, May 2015
  57. C.-Y. Lin, Y.-C. Huang, and T.-L. Wu, “Tri-Section Quarter Wavelength Resonator Common Mode Filter,” in Proc. Asia-Pacific Int. Symp. Electronmagn. Compat., Taipei, Taiwan, May 2015
  58. Y.-J. Lin, Y.-C. Tseng, C.-Y. Hsiao and T.-L. Wu, “A SMD-Type Filter Solution for EMI/RFI Mitigation on High-Speed Digital Interfaces and Its Application,” in Asia-Pacific Symp. Electromagn. Compat., Taipei, Taiwan, May 2015
  59. C.-H. Chen, Y.-C. Tseng, I-C. Lin, C.-C. Fu, and T.-L. Wu, “Transmission-Line Based Modeling for Conformal Shielding in Advanced System-in-Package (SiP),” in Asia-Pacific Symp. Electromagn. Compat., Taipei, Taiwan, May 2015
  60. C.-H. Cheng, and T.-L. Wu, “A Compact Dual-Band Common-Mode Filtering Component for EMC in Wireless Communication,” in Asia-Pacific Symp. Electromagn. Compat., Taipei, Taiwan, May 2015
  61. C.-H. Hung, C.-Y. Hsiao, and T.-L. Wu, “A novel common-mode filter (CMF) design based on signal interference technique,” in Proc. IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), pp. 125-128, Bangalore, India, Dec. 2014
  62. S.-K. Hsu, C.-C. Tseng, and T.-L. Wu, “Miniaturization technique for forward-wave directional couplers by using open stubs and patterned ground structures,” in Proc. Asia-Pacific Microw. Conference (APMC), Sendai, Japan, Nov. 2014
  63. H. Wang, T.-L. Wu, P. Hsu, R.-B. Wu, K.-Y. Lin, and T.-W. Huang, “Recent progress of advanced microwave and system-in-package integration technologies at National Taiwan University,” in Proc. Asia-Pacific Microw. Conference (APMC), Sendai, Japan, Nov. 2014
  64. C.-C. Chou and T.-L. Wu, “Statistical eye diagram prediction for a 8b10b-coded channel using pulse response,” in Proc. IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 43-46, Portland, USA, Oct. 2014
  65. H.-C. Chen, T.-L. Wu, S. Connor, and B. Archambeault, “Fast prediction of radiation from high-speed/high-density connectors,” in Proc. IEEE. Int. Symp. Electromagn. Compat., pp. 256-259, Raleigh, NC, Aug. 2014
  66. C.-K. Shen, T.-L. Wu, C.-H. Chen, and D.-H. Han, “Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression,” in Proc. IEEE. Int. Symp. Electromagn. Compat., pp. 357-361, Raleigh, NC, Aug. 2014
  67. S.-Y. Hsu, C.-C. Chou, and T.-L. Wu, “Signal integrity: Influence of non-linear driver, different bit rates, and estimation by different algorithms,” in Asia-Pacific Symp. Electromagn. Compat., pp. 121-124, Tokyo, May 2014
  68. C.-Y. Hsiao, S.-H. Wang, C.-C Wang, W.-S. Wang, Y.-H. Lin,and T.-L. Wu, “Radio-Frequency Interference Mitigation Strategies for High-Speed Connectors,” in Proc. Elect. Design Adv. Packag. Systems Symp., pp. 1-4, Nara, Japan, Dec. 2013
  69. C.-H. Cheng and T.-L. Wu, “A novel common-mode filter for multiple differential pairs with low crosstalk and low mode conversion level,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 259-262, San Jose, CA, Oct. 2013
  70. H.-C. Chen, S. Connor, T.-L. Wu, and B. Archambeault, “The effect of various skew compensation strategies on mode conversion and radiation from high-speed connectors,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 328-332, Denver, USA, Aug. 2013
  71. Y.-C. Tseng, P.-S. Chen, W.-C. Lo, S.-H. Wu, and T.-L. Wu, “Compact TSV-based wideband bandpass filters on 3-D IC,” in Proc. IEEE 63rd Electronic Components and Technology Conf., pp. 2083-2088, Nevada, USA, Mar. 2013
  72. C.-K. Shen, Y.-C. Lu, Y.-P. Chiou, T.-Y. Cheng, and T.-L. Wu, “Power distribution network modeling for 3-D ICs with TSV arrays,” 18th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 17-22, Yokohama, Japan, Jan. 2013
  73. Y.-C. Tseng, C.-B. Chang, C.-K. Tang, C.-H. Cheng, Y.-C. Lu, K.-Y. Lin, T.-L. Wu, and R.-B. Wu, “Design considerations for radio frequency 3DICs,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., pp. 197-200, Taipei, Taiwan, Dec. 2012
  74. K.-Y. Chen, Y.-A. Sheu, C.-H. Cheng, J.-H. Lin, Y.-P. Chiou, and T.-L. Wu, “A novel TSV model considering nonlinear MOS effect for transient analysis,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., pp. 49-52, Taipei, Taiwan, Dec. 2012
  75. J.-H. Lin, H.-P. Chang, T.-L. Wu, and Y.-P. Chiou, “3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., pp. 181-184, Taipei, Taiwan, Dec. 2012
  76. T.-H. Lin, J.-C. Yen, S.-K. Hsu, and T.-L. Wu, “A novel compact 3-dB forward-wave directional coupler with periodic capacitive enhancement,” in Proc. Asia-Pacific Microw. Conf., pp. 983-985, Kaohsiung, Taiwan, Dec. 2012
  77. T.-W. Weng and T. -L. Wu, “A novel miniaturized bandstop filter using defected ground on system in package (SiP),” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 296-298, Tempe, AZ, Oct. 2012
  78. Y.-J. Chang, H.-H. Chuang, Y.-C. Lu, Y.-P. Chiou, P.-S. Chen, S.-H. Wu, T.-Y. Kuo, C.-J. Zhan, W.-C. Lo, and T.-L. Wu, “Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: experimental validation and application to faraday cage design,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 232-235, Tempe, AZ, Oct. 2012
  79. C.-C. Chou, H.-H. Chuang, S.-H. Weng, C.-K. Cheng, and T.-L. Wu, “Eye prediction of digital driver with power distribution network noise,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 131-134, Tempe, AZ, Oct. 2012
  80. Y.-J. Cheng, H.-H. Chuang, and T.-L. Wu, “A Novel Dual-Functional Structure Integrating Differential-Mode Equalizer with Common-Mode Filter for Gbps Signaling,” in Proc. IEEE Eur. Electromagn. Compat. Conf., pp. 1-5, Rome, Italy, Sept. 2012
  81. T.-Y. Zheng, H.-H. Chuang, C.-D. Wang, P.-S. Chen, T.-Y. Kuo, C.-J. Zhen, S.-H. Wu, W.-C. Lo, Y.-C. Lu, Y.-P. Chiou, and T.-L. Wu, “Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer,” in Proc. 2012 IEEE 62nd Electronic Components and Technology Conf., pp. 1934-1938, San Diego, CA, USA, Jun. 2012
  82. Y.-J. Chang, C.-C. Chou, H.-H. Chuang, and T.-L. Wu, “A new solution and its estimation method for slot-crossing signals to reduce ISI-increased crosstalk,” in Asia-Pacific Symp. Electromagn. Compat., pp. 622-626, Singapore, May 2012
  83. T.-H. Lin, S.-K. Hsu, and T.-L. Wu, “A novel broadband forward-wave directional coupler design with periodical H-shaped structure,” in Proc. Asia-Pacific Microw. Conf., pp. 1770-1773, Melbourne, Australia, Dec. 2011
  84. S.-K. Hsu, T.-H. Lin, and T.-L. Wu, “Size-reduction of 3 dB microstrip forward-wave coupler using defected ground structure,” in Proc. Asia-Pacific Microw. Conf., pp. 1774-1777, Melbourne, Australia, Dec. 2011
  85. J.-C. Yen, S.-K. Hsu, and T.-L. Wu, “A novel compact backward-wave directional coupler desigh with defected ground structure,” in Proc. Asia-Pacific Microw. Conf., pp. 1150-1153, Melbourne, Australia, Dec. 2011
  86. Y.-J. Cheng, H.-H. Chuang, and T.-L. Wu, “A physics-based model of on-chip decoupling capacitor for accurate power integrity analysis,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., Hangzhou, China, Dec. 2011
  87. C.-H. Tsai, H.-C. Chen, and T.-L. Wu, “A broadband and miniaturized balun on system-in-package (SiP),” in Proc. IEEE IMPAC., pp. 103-106, Taipei, Taiwan, Oct. 2011
  88. H.-H. Chuang and T.-L. Wu, “A novel and low-cost method for slot-crossing differential line to reduce GHz common-mode radiation in advanced PCB,” in Proc. IEEE IMPAC., Taipei, Taiwan, Oct. 2011
  89. J.-C. Yen, S.-K. Hsu, and T.-L. Wu, “A novel miniaturized forward-wave directional coupler loaded with periodic shunt inductors,” in Proc. Eur. Microw. Conf., pp. 782-785, Manchester, United Kingdom, Oct. 2011
  90. Y.-L. Song, C.Yu, F.-C. Chuang, Y.-C. Tseng, J.-Y. Zou, S.-K. Hsu, T.-G. Ma, T.-L. Wu, and L.-M. Chang, “Analysis 2.5-D permutation power transmission line to decrease electro-magnetic influence at high technology nano-fab,” in Int. Conf. Energy, Environ., Sustainable Develop., Oct. 2011
  91. Y.-L. Song, C.Yu, F.-C. Chuang, Y.-C. Tseng, J.-Y. Zou, S.-K. Hsu, T.-G. Ma, T.-L. Wu, and L.-M. Chang, “Optimal permutation of power transmission line at high technology nano-fab to decrease electromagnetic influence,” in Annu. Symp. Antenna Meas. Tech. Association, Oct. 2011
  92. T.-Y. Cheng, C.-D. Wang, Y.-P. Chiou, and T.-L. Wu, “Accuracy-improved through-silicon-via model using conformal mapping technique,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 189-192, San Jose, USA, Oct. 2011
  93. C.-Y. Hsiao, C.-H. Huang, C.-D. Wang, K.-H. Liao, C.-H. Shen, C.-C. Wang, and T.-L. Wu, “Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules,” in Proc. IEEE. Int. Symp. Electromagn. Compat., pp. 341-344, California, USA, Aug. 2011
  94. H.-H. Chuang and T.-L. Wu, “A novel and cost-effective method to suppress GHz common-mode radiation for slot-crossing differential lines,” in Proc. IEEE. Int. Symp. Electromagn. Compat., pp. 720-723, California, USA, Aug. 2011
  95. H.-C. Chen and T.-L. Wu, “Suppression of RF interference using balanced filter in communication system,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 564-568, California, USA, Aug. 2011
  96. C.-H. Tsai, J.-Z. Hsu, I.-I. A. Ieong, and T.-L. Wu, “A novel common mode choke and its application for 5 Gbps USB 3.0,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 888-891, California, USA, Aug. 2011
  97. C.-D. Wang and T.-L. Wu, “Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 715-719, California, USA, Aug. 2011
  98. F.-C. Chuang, Y.-L. Song, C. Yu, S.-K. Hsu, T.-L. Wu, and L.-M. Chang, “Active field canceling system in next generation nano-fab,” in Int. Conf. Power Electron. Systems Applications, Jun. 2011
  99. Y.-L. Song, C. Yu, F.-C. Chuang, Y.-C. Tseng, J.-Y. Zou, S.-K. Hsu, T.-G. Ma, T.-L. Wu, and L.-M. Chang, “Evaluation of magnetic field from varied permutation power transmission line at high technology nano-fab,” in Int. Conf. Power Electron. Systems Applications, Jun. 2011
  100. F.-C. Chuang, Y.-L. Song, C. Yu, S.-K. Hsu, T.-L. Wu, and L.-M. Chang, “Magneto-resistive sensor readout circuit and field canceling system in next generation nano-fab,” in Proc. Asia-Pacific Int. Symp. Electronmagn. Compat., May 2011
  101. S.-K. Hsu, J.-C.Yen, and T.-L. Wu, “A novel microstrip forward directional coupler using defected ground structure,” in Asia-Pacific Microw. Conf., pp. 794-797, Yokohama, Japan, Dec. 2010
  102. C.-H. Huang, C.-Y. Hsiao, C.-D Wang, T. Chen, K.-H. Liao, and T.-L. Wu, “Conformal shielding investigation for SiP modules,” in Proc. Elect. Design Adv. Packag. Systems Symp., pp. 1-4, Singapore, Dec. 2010
  103. Y.-H. Hsu, C.-H. Tsai, and T.-L. Wu, “A new bandastop filter uisng artificial defected ground structures with,” in Proc. Elect. Performance Electron. Packag. Systems, pp. 89-92, Austin, USA, Oct. 2010
  104. S.-K. Hsu and T.-L. Wu, “A novel microstrip forward directional coupler based on an artificial substrate,” in Proc. Eur. Microw. Conf., pp. 926-929, Paris, France, Sept. 2010
  105. C.-D. Wang and T.-L. Wu, “A stopband enhanced EBG power/ground plane based on via location design,” in Proc. IEEE Compon. Packag. Manuf. Technol. Symp. Japan, Tokyo, Japan, Aug. 2010
  106. H.-H. Chuang and T.-L.Wu, “A new common-mode EMI suppression technique for GHz differential signals crossing slotted reference planes,” in Proc. IEEE. Int. Symp. Electronmagn. Compat., pp. 12-15, Folorida, USA, Jul. 2010
  107. I.-I. A. Ieong, C.-H. Tsai, and T.-L. Wu, “An ultra compact common-mode filter for RF interference control in 3G wireless communication systems,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 776-779, Folorida, USA, Jul. 2010
  108. C.-H. Cheng, C.-H. Tsai, and T.-L. Wu, “A novel time domain method to extract equivalent circuit model of patterned ground structures,” in Asia-Pacific Symp. Electromagn. Compat., pp. 622-626, Beijing, China, Apr. 2010
  109. A. C. Scogna, C.-D. Wang, A. Orlandi, and T.-L. Wu, “Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure,” in Asia-Pacific Symp. Electromagn. Compat., pp. 158-161, Beijing, China, Apr. 2010
  110. H.-H. Chuang, C.-J. Hsu, M.-Z. Hong, D. Hsu, R. Huang, L.-C. Hsiao, and T.-L. Wu, “Signal/power integrity design strategy for low-cost package of high-speed memory I/O interfaces,” in Proc. IEEE Electron. Design Adv. Packag. Systems Symp., pp. 1-4, Hong Kong, China, Dec. 2009
  111. C.-H. Tsai and T.-L. Wu, “A GHz common-mode filter using negative permittivity metamaterial on low temperature co-fire ceramic (LTCC) substrate,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 91-94, Austin, USA, Aug. 2009
  112. C.-H. Tsai and T.-L. Wu, “A metamaterial-typed differential transmission line with broadband common-mode suppression,” in Proc. IEEE Int. Symp. Electromagn. Compat. Eur. Workshop, Jun. 2009
  113. H.-H. Chuang, T.-L. Wu, and T.-K. Wang, “Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package,” in Asia-Pacific Microw. Conf., Hong Kong, Dec. 2008
  114. H.-H. Chuang, S.-J. Wu, M.-Z. Hong, D. Hsu, R. Huang, and T.-L. Wu, “Power integrity chip-package-PCB co-Simulation for I/O interface of DDR3 high-speed memory,” in Proc. Elect. Design Adv. Packag. Systems Symp., pp. 31-34, Seoul, Dec. 2008
  115. C.-Y. Hsieh, H.-H. Chuang, T.-K. Wang, C.-C. Wang, H.-H. Cheng, Y.-S. Wu, C.-T. Chiu, C.-P. Hung, and T.-L. Wu, “A novel stopband-enhanced EBG planes using an embedded slow-wave structure,” in Proc. Elect. Performance Electron. Packag. Systems, pp. 131-133, Oct. 2008
  116. S.-J. Wu, H.-H. Chuang, T.-K. Wang, and T.-L. Wu, “A novel HU-shaped common-mode filter for GHz differential signals,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 1-4, Aug. 2008
  117. C.-H. Shih, G.-H. Shiue, T.-L. Wu, and R.-B. Wu, “The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes,” in Asia-Pacific Symp. Electromagn. Compat., pp. 164-167, Singapore, May 2008
  118. T.-K. Wang, T.-W. Han, and T.-L. Wu, “A novel EBG power plane with stopband enhancement using artificial substrate,” in Proc. Elect. Performance Electron. Packag. Systems, pp. 193-196, Atlanta, Georgia, USA, Aug. 2007
  119. Y.-C. Chen, T.-K. Wang, S.-M. Lan, C.-H. Lu, and T.-L. Wu, “Broadband noise suppression using a hybrid photonic crystal power/ground plane substrate,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 1-4, Honolulu, Hawaii, USA, Jul. 2007
  120. H.-C. Kuo, S.-T. Chen, and T.-L. Wu, “Improving the radiated immunity of the strip-lines using a novel hybrid EBG structure,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 223-236, Oct. 2006
  121. S. Sun, D. Pommerenke, J. Drewniak,K. Xiao,S.-T. Chen, and T.-L. Wu, “Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 550-555, Portland, Oregon, USA, Aug. 2006
  122. H.-J. Ou, T.-S. Horng, and T.-L. Wu, “Power splitting analysis of 3×3 photonic crystal ,” Optoelectron. Commun. Conf., Southem Taiwan Opto-Electronics Center of Excellence National Su, Jul. 2006
  123. S.-T. Chen, T.-S. Horng, and T.-L. Wu, “Photonic crystal pwer substrate for wideband suppression of power/ground bounce noise and radiated emission in high-speed packages,” in Asia-Pacific Symp. Electromagn. Compat., vol. 1, pp. 498-500, Taipei, Taiwan, Dec. 2005
  124. H.-C. Kuo, S.-T. Chen, C.-C. Wang, S.-W. Wen, H.-C. Li, C.-C. Chien, and T.-L. Wu, “High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure,” in Asia-Pacific Symp. Electromagn. Compat., vol. 1, pp. 117-120, Taipei, Taiwan, Dec. 2005
  125. J.-S. Chiang and T.-L. Wu, “Polarization beam splitting in twin- elliptical-core photonic crystal fiber coupler,” in Int. Symp. Commun., Kaohsiung, Taiwan, Nov. 2005
  126. H.-J. Ou, T.-S. Horng, and T.-L. Wu, “A modified FDTD procedure for computing the electromagnetic bandgap (EBG) structure,” in Int. Conf. Electromagn. Applications Compat., Taipei, Taiwan, Oct. 2005
  127. T.-K. Wang, C.-C. Wang, S.-T. Chen, Y.-H. Lin, and T.-L. Wu, “A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 917-920, Chicago, USA, Aug. 2005
  128. H.-J. Ou and T.-L. Wu, “Analysis and solution of modes loss problem for computing the bandgap structure of periodic structures by 2-D FDTD method,” Int. Conf. Antennas, Radar, Wave Propag., Banff, Alberta, Canada, Jul. 2005
  129. C.-C. Wang, S.-M. Wu, C.-H. Chou, C.-W. Tsai, T.-K. Wang, Y.-H. Lin, S.-T. Chen, and T.-L. Wu, “A novel embedded power plane with 10GHz stopband for simultaneous switching noise,” in Proc. Electron. Compon. Technol. Conf., p.p. 769-771, Orlando, Jun. 2005
  130. T.-K. Wang, C.-C. Wang, Y.-H. Lin, and T.-L. Wu, “A new electromagnetic bandgap power plane with super-broadband suppression of ground bounce noise in high speed circuits,” In Int. Conf. Electromagn. Application Compat., Taipei, Oct. 2004
  131. S.-T. Chen, C.-W. Tsai, S.-M. Wu, C.-P. Hung, and T.-L. Wu, “Chip-level model of switching noise coupling on integrated system combining package and printed circuit board,” in Proc. IEEE Int. Symp. Electromagn. Compat. Eur. Workshop, vol. 1, pp. 420-424, Eindhoven, Netherland, Sept. 2004
  132. Y.-H. Lin and T.-L. Wu, “Analysis of radiation caused by SSN and transmission line by combining the equivalent circuits of active IC into FDTD,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 277-282, Santa Clara,USA, Aug. 2004
  133. T.-L. Wu, W.-C. Hung, C.-H. Lee, C.-W. Lin, W.-S. Jou, and W.-H. Cheng,, “A low-cost plastic package for 2.5Gbps optical transceiver module with high electromagnetic shielding,” in Proc. Electron. Compon. Technol. Conf., vol. 1, pp. 199-202, Jun. 2004
  134. J.-S. Chiang and T.-L. Wu, “A novel periodic structures in photonic crystal fibers,” in Pacific Rim Conf. Lasers Electro-Optics, vol. 1, pp. 17, Taipei, Dec. 2003
  135. C.-H. Chao and T.-L. Wu, “Photonic crystal fiber analysis through vector boundary-element method,” in Pacific Rim Conf. Lasers Electro-Optics, vol. 2, pp. 100, Taipei, Dec. 2003
  136. C.-H. Chao and T.-L. Wu, “Polarization and dispersion analysis of holey fibers with elliptical air holes through the vector boundary-element method,” in Annu. Meeting Lasers Electro-Optics Society, vol. 2, pp. 900-902, Tucson, USA, Oct. 2003
  137. S.-T. Chen, C.-W. Tsai, S.-M. Wu, C.-P. Hung, and T.-L. Wu, “Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB),” in Taiwan Electromagn. Compat. Conf., vol. 1, pp. 64-68, Oct. 2003
  138. W.-H. Cheng, T.-L. Wu and W.-S. Jou, “Electromagnetic shielding of plastic packaging in cost-effective optical transceiver modules,” in Annu. Meeting Lasers Electro-Optics Society, vol. 2, pp. 565-566, Tucson, USA, Oct. 2003
  139. C.-C. Kuo and T.-L. Wu, “ Time-domain SPICE model for coupled interconnects using the multi-conductor layer peeling technique,” in Int. Zurich Symp. Technical Exhibit. Electromagn. Compat., vol. 1, pp. 5-10, Feb. 2003
  140. H.-C. Chang, C.-C. Kuo, and T.-L. Wu, “A time-domain approach to extract SPICE-compatible equivalent models for embedded interconnects,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 2, pp. 834 -839, Minnesota,USA, Aug. 2002
  141. L.-R. Chen, Y.-H. Lin, and T.-L. Wu, “NSTL evaluation of the compact EMC chamber with ferrite tiles being partially lined on the floor ground,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 2, pp. 958-963, Minnesota,USA, Aug. 2002
  142. J.-N. Hwang and T.-L. Wu, “Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 2, pp. 733-736, Minnesota,USA, Aug. 2002
  143. L.-R. Chen, Y.-H. Lin, and T.-L. Wu, “NSTL evaluation of the compact EMC chamber with absorbers being partially lined on the floor ground,” in Electromagn. Compat. Conf., pp. 343-345, Taipei, Taiwan, Oct. 2001
  144. Y.-H. Lin and T.-L. Wu, “Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 1, pp. 319-324, Montreal, Canada, Aug. 2001
  145. J.-N. Hwang and T.-L. Wu, “The bridging effect of the isolation moat on the EMI caused by ground bounce noise between power/ground planes of PCB,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 1, pp. 471-474, Montreal, Canada, Aug. 2001
  146. C.-C. Kuo, Y.-H. Lin, and T.-L. Wu, “Crosstalk characterization of high-speed interconnects in time-domain,” in Proc. IEEE Int. Symp. Electromagn. Compat., vol. 1, pp. 657-660, Montreal, Canada, Aug. 2001
  147. S.-K. Chiu, J.-Y. Cheng, W.-S. Jou, S.-C. Wang, C.-M. Wang, C.-S. Lin, T.-L. Wu, and W.-H. Cheng, “Electromagnetic shielding of plastic packaging in laser diode modules,” in Proc. Electron. Compon. Technol. Conf., Florida, USA, May 2001
  148. 林彥輝、謝建勝、吳宗霖, “高速數位電路中不完整接地面對信號品質及電磁輻射的影響研究,” 2000 全國電信研討會, 中壢, Dec. 2000
  149. S.-K. Chiu, J.-Y. Cheng, W.-S. Jou, S.-C. Wang, C.-M. Wang, C.-S. Lin, T.-L. Wu, and W.-H. Cheng, “Electromagnetic shielding of plastic material in laser diode modules,” in Int. Photon. Conf., Hsichu, Taiwan, Dec. 2000
  150. C.-H. Chao and T.-L. Wu, “Investigation of the coupling characteristics for the 4 x 4 single-mode fused fiber couplers,” in Int. Photon. Conf., Hsichu, Taiwan, R.O.C, Dec. 2000
  151. T.-L. Wu, “Vectorial analysis for polarization effect of wavelength-flattened fiber-optic couplers,” in Int. Photon. Conf., Hsichu, Taiwan, R.O.C, Dec. 2000
  152. J.-J. Lin and T.-L. Wu, “FDTD modeling of the coaxial effect on the measurement of ground bounce in the high speed digital PCB,” in Proc. IEEE Int. Symp. Electromagn. Compat., Washington DC, Aug. 2000
  153. T.-L. Wu, “Rigorous analysis of fiber-core effect for fused fiber-optic couplers,” in IEEE Inter. Symp. Antenna Propag. URSI, Orlando, Florida, Jul. 1999
  154. T.-L. Wu and H.-C. Chang, “Rigorous analysis of polarization effect of wavelength-flattened fused fiber-optic couplers,” in Progress in Electromagn. Research Symp., 1999
  155. S.-C. Chao and T.-L. Wu, “Bypass capacitance effect both on the signal integrity and electromagnetic radiation for high-speed clock circuits,” Progress Electromagn. Research Symp., 1999
  156. H.-C. Chang, C.-W. Wu, T.-L. Wu, S.-W. Yang, and G.-J. Liao, “Fabrication and electromagnetic modeling of fiber-optic coupling devices based on weakly fused tapered structure,” in Taiwan Optoelectron. Ind. Technol. Develop. Conf., Hsinchu, Taiwan, R.O.C, Jul. 1997
  157. H.-C. Chang, T.-L. Wu, and C.-W. Wu, “Three-dimensional modeling of fused biconical optical fiber coupling devices,” in Progress Electromagn. Research Symp., Seattle, Washington, Jul. 1995
  158. T.-L. Wu, C.-W. Wu, and H.-C. Chang, “Simulation of polarization and spectral responses of fused tapered fiber-optic couplers,” In Int. Conf. Integr. Opt. Optical Fibre Commun., Hong Kong, Jun. 1995
  159. T.-L. Wu and H.-C. Chang,, “Form birefringence of biconical-taper fiber-optic couplers under weakly fused condition,” in Topical Meeting Integr. Photon. Research, Dana Point, California, Feb. 1995
  160. T.-L. Wu and H.-C. Chang, “A novel dispersion calculation method for elliptical-core fiber-optic dispersion compensators,” in Int. Symp. Commun., National Taiwan University, Taipei, Taiwan, R.O.C, Feb. 1995
  161. T.-L. Wu and H.-C. Chang, “A vectorial simulation model for fused tapered optical couplers,” in Topical Meeting Integr. Photon. Research, San Francisco, California, Feb. 1994

Books:

  1. Tzong-Lin Wu and Chiu-Chih Chou, “Chp.16: Differential-Mode Equalizers with Common-Mode Filtering, in Ferran Martin, Lei Zhu, Jiasheng Hong, Francisco Medina, Editor, Balanced Microwave Filters,” Wiley-IEEE Press, Mar. 2018
  2. Melinda Piket-May, Wojciech K. Gwarek, Tzong-Lin Wu, Bijan Houshmand, Tatsuo Itoh, and J. J. Simpson, “Chp.15: High-Speed Electronic Circuits With Active and Nonlinear Components in A. Taflove and S. Hagness, Editor, Computational Electrodynamics: The Finite-Diffeernce Time-Domain Method (3rd Edition),” Jun. 2005

Patents:

  1. 吳宗霖, 蔡仲豪, 蕭志穎, “濾波裝置與濾波電路,” 中華民國, I462386, Nov. 2014
  2. 吳宗霖, 蔡仲豪, 歐陽逸賢, “共模雜訊抑制電路,” 中華民國, I460918, Nov. 2014
  3. 吳宗霖, 蔡仲豪, “數位電子元件,” US8878630, Nov. 2014
  4. 吳宗霖, 蔡仲豪, “電磁雜訊抑制電路,” 中華民國, I440408, Jun. 2014
  5. 吳宗霖,莊皓翔,鄭余任, “傳輸線結構,” 中華民國, I435665, Apr. 2014
  6. 吳宗霖, 蔡仲豪, 歐陽逸賢, “共模雜訊抑制電路,” US 8,659,365, Feb. 2014
  7. Tzong-Lin Wu, Chung-Hao Tsai, “Electromagnetic noise suppression circuit,” US 8,552,811 B2, Oct. 2013
  8. 吳宗霖,莊皓翔,鄭余任, “傳輸線,” US 8,508,311, Aug. 2013
  9. 吳宗霖, 王挺光, 莊皓翔, 謝嘉原, “電磁雜訊抑制裝置,” 中華民國專利 I-333829, Nov. 2010
  10. Tzong-Lin Wu and Shu-Jung Wu, “Common mode filtering method and device,” US 7,932,793 B2, Apr. 2010
  11. Kuo-Ching Steven Hsu, Chien-Min Lin, Guan-Tzong Wu, Tzong-Lin Wu, “Capacitors with insulating layer having embedded dielectric rods,” US 7,679,926, Mar. 2010
  12. 吳宗霖,王挺光,陳信廷,王建中,王陳肇, 歐宏俊,吳松茂,蔡志偉, 周佳興, “抑制雜訊之內嵌電源平面及包含該電源平面之多層結構,” 中華明國 296493, May 2008
  13. Tzong-Lin Wu and Chia-Hsin Chao, “Broadband ultra-flattened dispersion micro-structured fiber,” US 7184637 B2, Feb. 2007
  14. Tzong-Lin Wu, Yen-Hui Lin, Sing-Ting Chen, Ting-Kuang Wang, “Power plane system of high-speed digital circuit for suppressing ground bounce noise,” US 7148425 B2, Dec. 2006
  15. 吳宗霖，郭俊志, “耦合互連結構等效寬頻模型之時域分析系統及方法,” 中華名國，I 246288, Dec. 2005
  16. 吳宗霖，趙嘉信, “超寬頻色散平坦為結構光纖,” 中華民國，I-239411, Sept. 2005
  17. 吳宗霖，林彥輝，陳信廷, “用於多層結構之電源層系統,” 中華民國，I-233775, Jun. 2005
  18. Structure and method for reducing em radiation, and electric object and manufacturing method thereof, “Tzong-Lin Wu, Hao-Hsiang Chuang,” US 8,554,075 B2
  19. Tzong-Lin Wu, Chung-Hao Tsai, “Filtering device and differential signal transmission circuit capable of suppressing common-mode noises upon transmission of a differential signal,” US 8,339,212 B2
  20. Yu-Hao Hsu, Chung-Hao Tsai, Tzong-Lin Wu, “Defected ground structure with shielding effect,” US
  21. Iat In Ao Ieong, Chung-Hao Tsai, Tzong-Lin Wu, “Common mode noise suppression circuit,” US
  22. Iat In Ao Ieong, Chung-Hao Tsai, Tzong-Lin Wu, “Common mode noise suppression circuit,” EP